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颗粒尺寸对B_4C增强铝基中子吸收材料界面反应与力学性能的影响 期刊论文
复合材料学报, 2018, 页码: 12
Authors:  童攀;  林立;  王全兆;  周杨韬;  肖伯律;  马宗义
Favorite  |  View/Download:14/0  |  Submit date:2021/02/02
粉末冶金  颗粒尺寸  致密度  界面反应  力学性能  铝基复合材料  
Low cycle fatigue behaviors of pure Mo and Mo-La2O3 alloys 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 707, 页码: 295-305
Authors:  Cheng, P. M.;  Zhang, Z. J.;  Zhang, G. J.;  Zhang, J. Y.;  Wu, K.;  Liu, G.;  Fu, W.;  Sun, J.;  Liu, G;  Sun, J (reprint author), Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Shaanxi, Peoples R China.
Favorite  |  View/Download:55/0  |  Submit date:2018/01/10
Molybdenum  Rare Earth Oxide Addition  Mechanical Properties  Fatigue Behaviors  Cycle Fatigue Mechanism  
热处理工艺对TRIP980钢板点焊性能的影响 期刊论文
焊接学报, 2017, 卷号: 38, 期号: 8, 页码: 111-114
Authors:  魏世同;  陆善平
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电阻点焊  焊接参数  热处理  拉剪性能  熔核尺寸  
制备工艺条件对GH4698合金宏观组织形态的影响 会议论文
第十三届中国高温合金年会摘要文集
Authors:  张北江;  廉心桐;  陈丽芳;  胥国华;  秦鹤勇;  张文云;  陈石富;  赵光普
Favorite  |  View/Download:21/0  |  Submit date:2016/04/20
低倍组织  锻压试验  Gh4698  全尺寸  组织形态  优化制备工艺  唯象理论  定性试验  质量稳定性  制备工艺条件  
Low-temperature plasma nitriding of titanium layer on Ti/Al clad sheet 期刊论文
Materials & Design, 2013, 卷号: 47, 页码: 408-415
Authors:  J. Sun;  W. P. Tong;  L. Zuo;  Z. B. Wang
Favorite  |  View/Download:29/0  |  Submit date:2013/12/24
Titanium/aluminum Clad Sheet  Surface Mechanical Attrition Treatment  Plasma Nitriding  Wear Resistance  Corrosion  Mechanical Attrition Treatment  Nanostructured Surface-layer  Metallic  Materials  Ti-6al-4v Alloy  Grain  Iron  Diffusion  Kinetics  Microstructure  Aluminum  
Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文
Journal of Alloys and Compounds, Journal of Alloys and Compounds, 2011, 2011, 卷号: 509, 509, 期号: 5, 页码: 1785-1789, 1785-1789
Authors:  T. Y. Kang;  Y. Y. Xiu;  C. Z. Liu;  L. Hui;  J. J. Wang;  W. P. Tong
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Bi Segregation  Bi Segregation  Interconnect  Interconnect  Kinetics  Kinetics  Intermetallic Compound Growth  Intermetallic Compound Growth  Lead-free Solders  Lead-free Solders  Cu  Cu  
Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 9, 页码: 856-860
Authors:  Xu B;  Tong W P;  Liu C Z;  Zhang H;  Zuo L;  He J C
Favorite  |  View/Download:5/0  |  Submit date:2021/02/02
CARBON  NI-63  Diffusion  Activation energy  High magnetic field  Al  Cu  
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
Authors:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P;  Liu C Z
Favorite  |  View/Download:5/0  |  Submit date:2021/02/26
SN-AG  CU SUBSTRATE  INTERFACIAL REACTIONS  MICROSTRUCTURE  COPPER  BI  TEMPERATURE  STRENGTH  ALLOYS  JOINTS  Solder  Interfacial reaction  Intermetallics  Kinetics  
焊丝成分对高速列车转向架焊接接头性能的影响 期刊论文
焊接学报, 2010, 期号: 6, 页码: 21-24+114
Authors:  陆善平;  魏世同;  李殿中;  李依依;  何广忠;  赵旭
Favorite  |  View/Download:12/0  |  Submit date:2012/04/12
熔合比  过渡系数  微观组织  力学性能  
Simulation of electromagnetic-flow fields in Mg melt under pulsed magnetic field 期刊论文
Transactions of Nonferrous Metals Society of China, 2010, 卷号: 20, 期号: 2, 页码: 283-288
Authors:  B. Wang;  Y. S. Yang;  X. P. Ma;  W. H. Tong
Adobe PDF(804Kb)  |  Favorite  |  View/Download:20/0  |  Submit date:2012/04/13
Pulsed Magnetic Field  Numerical Simulation  Pure Mg  Microstructure  Refinement  Structure Refinement  Pure Aluminum  Alloy  Microstructure  Solidification  Al  Vibrations  Magnesium  Az91d