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Effects of Surface Roughness on Interface Bonding Performance for 316H Stainless Steel in Hot-Compression Bonding 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2023, 页码: 19
Authors:  Zhao, Yong;  Xie, Bi-Jun;  Zhang, Jin-Long;  Wang, Qin-Qiang;  Xu, Bin;  Guo, Jiang;  Jin, Zhu-Ji;  Kang, Ren-Ke;  Li, Dian-Zhong
Favorite  |  View/Download：16/0  |  Submit date：2023/05/09
Surface roughness  Interface bonding performance  Hot-compression bonding  Mapping relation  Critical state  
Interfacial Oxides Evolution of High-Speed Steel Joints by Hot-Compression Bonding 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 12
Authors:  Liu, Wei-Feng;  Xie, Bi-Jun;  Sun, Ming-Yue;  Xu, Bin;  Cao, Yan-Fei;  Li, Dian-Zhong
Favorite  |  View/Download：75/0  |  Submit date：2022/07/14
Hot-compression bonding  High-speed steel  Interfacial oxides  Interface healing  Mechanical properties  
压力容器大锻件构筑成形过程界面氧化物及组织演化机理研究 学位论文
, 沈阳: 中国科学院金属研究所, 2020
Authors:  谢碧君
Favorite  |  View/Download：118/0  |  Submit date：2021/03/15
Evolution of the interfacial microstructure during the plastic deformation bonding of copper 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 746, 页码: 1-10
Authors:  Zhang, Jian Yang;  Sun, Ming Yue;  Xu, Bin;  Hu, Xin;  Liu, Sheng;  Xie, Bi Jun;  Li, Dian Zhong
Favorite  |  View/Download：81/0  |  Submit date：2021/02/02
Copper bonding  Hot compression bonding  Dynamic recrystallization  Grain boundary  Dislocation wall  
一种高温合金GH984G18热加工工艺的制定方法 专利
专利类型: 发明专利, 专利号: 201511025177.8, 申请日期: 2018-08-28,
Inventors:  孙明月;  谢碧君;  郭逸丰;  徐斌;  李殿中
Favorite  |  View/Download：87/0  |  Submit date：2021/02/02
GH984G18合金热加工图及再结晶图研究 期刊论文
材料工程, 2016, 期号: 9, 页码: 16-23
Authors:  谢碧君;  郭逸丰;  徐斌;  孙明月;  李殿中
Favorite  |  View/Download：90/0  |  Submit date：2016/12/28
Gh984g18合金  热压缩  热加工图  再结晶图  
定向凝固高温合金DZ125L的变形和再结晶 期刊论文
材料研究学报, 2012, 期号: 6, 页码: 632-636
Authors:  申健;  濮晟;  任建军;  薛新强;  毕克文;  卢玉章;  王莉;  谢光
Favorite  |  View/Download：82/0  |  Submit date：2013/02/23
金属材料  定向凝固高温合金  再结晶  电子背散射衍射  压痕