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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
Authors:  Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
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