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Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
Authors:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
Favorite  |  View/Download:1/0  |  Submit date:2021/02/02
SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism  
铜/无铅焊料界面组织与力学性能研究 学位论文
: 中国科学院金属研究所, 2013
Authors:  张青科
Favorite  |  View/Download:8/0  |  Submit date:2014/01/17
SnBi/Cu界面Bi偏聚机制与时效脆性抑制 期刊论文
中国科学:技术科学, 2012, 期号: 1, 页码: 13-21
Authors:  张青科;  邹鹤飞;  张哲峰
Favorite  |  View/Download:3/0  |  Submit date:2013/02/23
Snbi焊料  Bi偏聚  界面脆性  基体合金化  回流温度  
SnBi/Cu界面Bi偏聚机制与时效脆性抑制 期刊论文
中国科学:技术科学, 2012, 卷号: 42.0, 期号: 1.0, 页码: 13-21
Authors:  张青科;  邹鹤飞;  张哲峰
Favorite  |  View/Download:1/0  |  Submit date:2021/02/02
SnBi焊料  Bi偏聚  界面脆性  基体合金化  回流温度  
SnBi/Cu界面Bi偏聚机制与时效脆性抑制 期刊论文
中国科学:技术科学, 2012, 卷号: 42.0, 期号: 1.0, 页码: 13-21
Authors:  张青科;  邹鹤飞;  张哲峰
Favorite  |  View/Download:1/0  |  Submit date:2021/02/02
SnBi焊料  Bi偏聚  界面脆性  基体合金化  回流温度  
金属材料疲劳损伤的界面效应 期刊论文
金属学报, 2009, 期号: 7, 页码: 788-800
Authors:  张哲峰;  张鹏;  田艳中;  张青科;  屈伸;  邹鹤飞;  段启强;  李守新;  王中光
Favorite  |  View/Download:3/0  |  Submit date:2012/04/12
晶界  孪晶界  相界  互连界面  疲劳裂纹  
INTERFACIAL EFFECTS OF FATIGUE CRACKING IN METALLIC MATERIALS 期刊论文
ACTA METALLURGICA SINICA, 2009, 卷号: 45, 期号: 7, 页码: 788-800
Authors:  Zhang Zhefeng;  Zhang Peng;  Tian Yanzhong;  Zhang Qingke;  Qu Shen;  Zou Hefei;  Duan Qiqiang;  Li Shouxin;  Wang Zhongguang
Favorite  |  View/Download:1/0  |  Submit date:2021/02/02
grain boundary  twin boundary  phase boundary  interconnect interface  fatigue cracking