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TEM study on the morphology and interface microstructure of C/C-SiC composites fabricated by liquid infiltration 期刊论文
Authors:  Zhang, K. X.;  Guo, X. S.;  Cheng, Y. X.;  Zhang, F. Q.;  He, L. L.
Favorite  |  View/Download:63/0  |  Submit date:2021/10/15
Composites  C  C-SiC  Liquid silicon infiltration  TEM  Morphology  Interfacial microstructure  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
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alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength  
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
Authors:  F. F. Tian;  Z. Q. Liu
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48sn52in  Imc  Morphology  Orientation Relationship  Ebsd  Interfacial Reactions  Soldering Reaction  Joint Reliability  Void  Formation  Solid-state  Sn  Cu3sn  Alloy  Creep  
Magnetic effect on the interfacial energy of the Ni(111)/Cr(110) interface 期刊论文
Journal of Physics-Condensed Matter, 2014, 卷号: 26, 期号: 35
Authors:  S. Lu;  H. L. Zhang;  Q. M. Hu;  M. P. J. Punkkinen;  B. Johansson;  L. Vitos
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Ni/cr Interface  Interfacial Energy  Work Of Separation  Ab Initio  Ni-cr Alloy  Augmented-wave Method  Fcc-bcc Boundaries  Ab-initio  Crystallography  Simulation  Morphology  Metals  Misfit  Shape  
Effect of ruthenium on high-temperature creep rupture life of a single crystal nickel-based superalloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 2011, 卷号: 528, 528, 期号: 29-30, 页码: 8381-8388, 8381-8388
Authors:  X. P. Tan;  J. L. Liu;  T. Jin;  Z. Q. Hu;  H. U. Hong;  B. G. Choi;  I. S. Kim;  C. Y. Jo
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Nickel-based Superalloy  Nickel-based Superalloy  Ruthenium (Ru)  Ruthenium (Ru)  Microstructural Evolution  Microstructural Evolution  Creep  Creep  Misfit  Misfit  Interfacial Dislocation Networks  Interfacial Dislocation Networks  Precipitate Morphology  Precipitate Morphology  Rhenium  Rhenium  Additions  Additions  Phase-stability  Phase-stability  Heat-treatment  Heat-treatment  Ru  Ru  Microstructure  Microstructure  Interdiffusion  Interdiffusion  Intermediate  Intermediate  Deformation  Deformation  
Preferential growth and orientation relationship of Ag(3)Sn grains formed between molten Sn and (001) Ag single crystal 期刊论文
Journal of Materials Research, 2009, 卷号: 24, 期号: 6, 页码: 2141-2144
Authors:  H. F. Zou;  H. J. Yang;  J. Tan;  Z. F. Zhang
Adobe PDF(972Kb)  |  Favorite  |  View/Download:37/0  |  Submit date:2012/04/13
Lead-free Solders  Interfacial Reaction  Cu  Morphology