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TEM study on the morphology and interface microstructure of C/C-SiC composites fabricated by liquid infiltration
期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 175, 页码: 7
Authors:
Zhang, K. X.
;
Guo, X. S.
;
Cheng, Y. X.
;
Zhang, F. Q.
;
He, L. L.
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View/Download:63/0
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Submit date:2021/10/15
Composites
C
C-SiC
Liquid silicon infiltration
TEM
Morphology
Interfacial microstructure
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:
Cao Lihua
;
Chen Yinbo
;
Shi Qiyuan
;
Yuan Jie
;
Liu Zhiquan
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View/Download:176/0
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Submit date:2021/02/02
alloy element
Sn-Ag-Cu solder
intermetallic compound
interfacial morphology
shear strength
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate
期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
Authors:
F. F. Tian
;
Z. Q. Liu
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Submit date:2014/03/14
48sn52in
Imc
Morphology
Orientation Relationship
Ebsd
Interfacial Reactions
Soldering Reaction
Joint Reliability
Void
Formation
Solid-state
Sn
Cu3sn
Alloy
Creep
Magnetic effect on the interfacial energy of the Ni(111)/Cr(110) interface
期刊论文
Journal of Physics-Condensed Matter, 2014, 卷号: 26, 期号: 35
Authors:
S. Lu
;
H. L. Zhang
;
Q. M. Hu
;
M. P. J. Punkkinen
;
B. Johansson
;
L. Vitos
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Submit date:2015/01/14
Ni/cr Interface
Interfacial Energy
Work Of Separation
Ab Initio
Ni-cr Alloy
Augmented-wave Method
Fcc-bcc Boundaries
Ab-initio
Crystallography
Simulation
Morphology
Metals
Misfit
Shape
Effect of ruthenium on high-temperature creep rupture life of a single crystal nickel-based superalloy
期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 2011, 卷号: 528, 528, 期号: 29-30, 页码: 8381-8388, 8381-8388
Authors:
X. P. Tan
;
J. L. Liu
;
T. Jin
;
Z. Q. Hu
;
H. U. Hong
;
B. G. Choi
;
I. S. Kim
;
C. Y. Jo
Adobe PDF(2800Kb)
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Submit date:2012/04/13
Nickel-based Superalloy
Nickel-based Superalloy
Ruthenium (Ru)
Ruthenium (Ru)
Microstructural Evolution
Microstructural Evolution
Creep
Creep
Misfit
Misfit
Interfacial Dislocation Networks
Interfacial Dislocation Networks
Precipitate Morphology
Precipitate Morphology
Rhenium
Rhenium
Additions
Additions
Phase-stability
Phase-stability
Heat-treatment
Heat-treatment
Ru
Ru
Microstructure
Microstructure
Interdiffusion
Interdiffusion
Intermediate
Intermediate
Deformation
Deformation
Preferential growth and orientation relationship of Ag(3)Sn grains formed between molten Sn and (001) Ag single crystal
期刊论文
Journal of Materials Research, 2009, 卷号: 24, 期号: 6, 页码: 2141-2144
Authors:
H. F. Zou
;
H. J. Yang
;
J. Tan
;
Z. F. Zhang
Adobe PDF(972Kb)
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View/Download:37/0
  |  
Submit date:2012/04/13
Lead-free Solders
Interfacial Reaction
Cu
Morphology