Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach | |
Lu, K; Lu, J | |
Corresponding Author | Lu, K(kelu@imr.ac.cn) |
1999-05-01 | |
Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
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ISSN | 1005-0302 |
Volume | 15Issue:3Pages:193-197 |
Abstract | In this paper, a concept of surface nanocrystallization (SNC) of metallic materials is introduced. Three types of SNC processes are classified. Different SNC mechanisms and possible techniques for SNC are discussed with emphasis on mechanically induced surface self-nanocrystallization. Further development and prospects are addressed with respect to the properties and behaviors of the materials with a nanocrystalline surface. Enhancement of the behavior of the engineering materials by means of the SNC technology and its industrial application possibilities are analyzed. |
Indexed By | SCI |
Language | 英语 |
WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000080601900002 |
Publisher | JOURNAL MATER SCI TECHNOL |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/109427 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Lu, K |
Affiliation | 1.Chinese Acad Sci, Met Res Inst, State Key Lab RSA, Shenyang 110015, Peoples R China 2.Univ Technol Troyes, LASMIS, F-10000 Troyes, France |
Recommended Citation GB/T 7714 | Lu, K,Lu, J. Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,1999,15(3):193-197. |
APA | Lu, K,&Lu, J.(1999).Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,15(3),193-197. |
MLA | Lu, K,et al."Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 15.3(1999):193-197. |
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