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MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION
Li Yesheng1; Wang Wei2
Corresponding AuthorLi Yesheng(nfyyliyesheng@tom.com)
2010-09-11
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume46Issue:9Pages:1098-1102
AbstractHardness (H) and elastic modulus (E) of 1 mu m thick Cu film deposited on Si substrate were measured by means of nanoindentation technique. The E value of Cu film obtained by using single stiffness measurement (SSM) is consistent with that obtained from continuous stiffness measurement (CSM). However, the H value obtained from SSM is much smaller than that from CSM because of occurrence of significant creep during the holding period at ambient temperature. The analysis of loading curves shows that the substrate effect on hardness measurement appears as the indentation depth is about 528-587 nm, indicating the ratio of penetration depth to film thickness (about 0.5) is consistent with the finite element calculation.
Keywordnanoindentation Cu film hardness elastic modulus
Funding OrganizationNational Natural Science Foundation of China ; Natural Science Foundation of Jiangxi Province
DOI10.3724/SP.J.1037.2009.00859
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China[50571097] ; Natural Science Foundation of Jiangxi Province[2007GZC0712]
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000282804800012
PublisherSCIENCE CHINA PRESS
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/102696
Collection中国科学院金属研究所
Corresponding AuthorLi Yesheng
Affiliation1.Jiangxi Univ Sci & Technol, Sch Mat Sci & Chem Engn, Ganzhou 341000, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Li Yesheng,Wang Wei. MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION[J]. ACTA METALLURGICA SINICA,2010,46(9):1098-1102.
APA Li Yesheng,&Wang Wei.(2010).MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION.ACTA METALLURGICA SINICA,46(9),1098-1102.
MLA Li Yesheng,et al."MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION".ACTA METALLURGICA SINICA 46.9(2010):1098-1102.
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