| MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION | |
| Li Yesheng1; Wang Wei2 | |
| Corresponding Author | Li Yesheng(nfyyliyesheng@tom.com) |
| 2010-09-11 | |
| Source Publication | ACTA METALLURGICA SINICA
 |
| ISSN | 0412-1961 |
| Volume | 46Issue:9Pages:1098-1102 |
| Abstract | Hardness (H) and elastic modulus (E) of 1 mu m thick Cu film deposited on Si substrate were measured by means of nanoindentation technique. The E value of Cu film obtained by using single stiffness measurement (SSM) is consistent with that obtained from continuous stiffness measurement (CSM). However, the H value obtained from SSM is much smaller than that from CSM because of occurrence of significant creep during the holding period at ambient temperature. The analysis of loading curves shows that the substrate effect on hardness measurement appears as the indentation depth is about 528-587 nm, indicating the ratio of penetration depth to film thickness (about 0.5) is consistent with the finite element calculation. |
| Keyword | nanoindentation Cu film hardness elastic modulus |
| Funding Organization | National Natural Science Foundation of China ; Natural Science Foundation of Jiangxi Province |
| DOI | 10.3724/SP.J.1037.2009.00859 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Natural Science Foundation of China[50571097] ; Natural Science Foundation of Jiangxi Province[2007GZC0712] |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000282804800012 |
| Publisher | SCIENCE CHINA PRESS |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/102696 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Li Yesheng |
| Affiliation | 1.Jiangxi Univ Sci & Technol, Sch Mat Sci & Chem Engn, Ganzhou 341000, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| Recommended Citation GB/T 7714 | Li Yesheng,Wang Wei. MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION[J]. ACTA METALLURGICA SINICA,2010,46(9):1098-1102. |
| APA | Li Yesheng,&Wang Wei.(2010).MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION.ACTA METALLURGICA SINICA,46(9),1098-1102. |
| MLA | Li Yesheng,et al."MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION".ACTA METALLURGICA SINICA 46.9(2010):1098-1102. |
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