MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION

doi:10.3724/SP.J.1037.2009.00859

IMR OpenIR

	MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION
	Li Yesheng 1; Wang Wei 2
通讯作者	Li Yesheng(nfyyliyesheng@tom.com)
	2010-09-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	46 期号:9 页码:1098-1102
摘要	Hardness (H) and elastic modulus (E) of 1 mu m thick Cu film deposited on Si substrate were measured by means of nanoindentation technique. The E value of Cu film obtained by using single stiffness measurement (SSM) is consistent with that obtained from continuous stiffness measurement (CSM). However, the H value obtained from SSM is much smaller than that from CSM because of occurrence of significant creep during the holding period at ambient temperature. The analysis of loading curves shows that the substrate effect on hardness measurement appears as the indentation depth is about 528-587 nm, indicating the ratio of penetration depth to film thickness (about 0.5) is consistent with the finite element calculation.
关键词	nanoindentation Cu film hardness elastic modulus
资助者	National Natural Science Foundation of China ; Natural Science Foundation of Jiangxi Province
DOI	10.3724/SP.J.1037.2009.00859
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[50571097] ; Natural Science Foundation of Jiangxi Province[2007GZC0712]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000282804800012
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/102696
专题	中国科学院金属研究所
通讯作者	Li Yesheng
作者单位	1.Jiangxi Univ Sci & Technol, Sch Mat Sci & Chem Engn, Ganzhou 341000, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Li Yesheng,Wang Wei. MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION[J]. ACTA METALLURGICA SINICA,2010,46(9):1098-1102.
APA	Li Yesheng,&Wang Wei.(2010).MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION.ACTA METALLURGICA SINICA,46(9),1098-1102.
MLA	Li Yesheng,et al."MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION".ACTA METALLURGICA SINICA 46.9(2010):1098-1102.