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Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders
Zou, H. F.1,2; Yang, H. J.1; Zhang, Z. F.1
Corresponding AuthorZhang, Z. F.(zhfzhang@imr.ac.cn)
2011-12-15
Source PublicationMATERIALS CHEMISTRY AND PHYSICS
ISSN0254-0584
Volume131Issue:1-2Pages:190-198
AbstractDuring the reflowing procedure, the Cu concentration in the solder affects the coarsening mechanisms of intermetallic compound (IMC) grains. For the Sn3Cu solder, the mean radius of the IMC grains was proportional to the cube root of the reflowing time; while it follows the square root relation with the reflowing time for the SnAgCu and Sn solders. It is proposed that the flux from the substrate was only consumed to coarsen the IMC grains for Sn3Cu solder, while it was separated into two fluxes for the SnAgCu and Sn solders at the reflowing initial procedure. For the Sn3.8Ag0.7Cu/Cu and Sn/Cu couples, the size distribution of the IMC grains well agrees with the modified flux driven ripening (FDR) model when the value of r/(r) is above 1; while it would closely match with Marqusee and Ross analysis when the value of r/(r) is below 1. For Sn3Cu/Cu couple, the size distribution of IMC grains shows good agreement with the FDR model. However, for SnPb/poly-Cu, during the solid-state aging procedure, the mean radius of the IMC grains was proportional to the cube root of the aging time. And the size distribution of IMC grains is well consistent with the FDR model. (C) 2011 Elsevier B.V. All rights reserved.
KeywordIntermetallic compounds Nucleation Interface EBSD
Funding OrganizationNational Basic Research Program of China ; National Outstanding Young Scientist Foundation
DOI10.1016/j.matchemphys.2011.08.061
Indexed BySCI
Language英语
Funding ProjectNational Basic Research Program of China[2010CB631006] ; National Outstanding Young Scientist Foundation[50625103]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000298764800032
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:17[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/104174
Collection中国科学院金属研究所
Corresponding AuthorZhang, Z. F.
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Capital Aerosp Machinery Co, Beijing 100076, Peoples R China
Recommended Citation
GB/T 7714
Zou, H. F.,Yang, H. J.,Zhang, Z. F.. Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders[J]. MATERIALS CHEMISTRY AND PHYSICS,2011,131(1-2):190-198.
APA Zou, H. F.,Yang, H. J.,&Zhang, Z. F..(2011).Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders.MATERIALS CHEMISTRY AND PHYSICS,131(1-2),190-198.
MLA Zou, H. F.,et al."Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders".MATERIALS CHEMISTRY AND PHYSICS 131.1-2(2011):190-198.
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