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EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION
Wang Changgang; Dong Junhua; Ke Wei; Chen Nan
Corresponding AuthorDong Junhua(jhdong@imr.ac.cn)
2011-03-11
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume47Issue:3Pages:354-360
AbstractThe strategy for disposal of high-level radioactive waste in china is to enclose the spent nuclear fuel in sealed metal canisters which are embedded in bentonite clay hundreds meters deep in the bed-rock. The choice of container material depends largely on the redox conditions and the aqueous environment of the repository. One of the choices for the fabrication of waste canisters is copper, for it is thermodynamically stable under the saline, anoxic conditions over the large majority of the container lifetime. For this advantage, some other countries (Canada, Sweden) have selected copper as the material of nuclear waste container. However, in the early aerobic phase of the geological disposal the corrosion of copper could take place, and the corrosion behavior of copper would be influenced by the complex chemical conditions of groundwater markedly. Regularly, in atmosphere environment the semiconductor passive film which is constructed by Cu2O would generate on the surface of copper. On the one hand, the Cu2O film could protect copper from corrosion. On the other hand, the formation of Cu2O film is necessary to maintain the propagation of crack during the stress corrosion cracking. Therefore, the study of the effect of water chemistry conditions on the stability of Cu2O passive film makes great sense for the general corrosion and stress corrosion cracking of copper. For copper and copper alloy, Cl- is a highly aggressive ion. Lots of cases of failure and corrosion behavior of copper and copper alloy in Cl- environment have been studied. The immersion of Cl- would affect the semiconductor properties of Cu2O, therefore, we focused on the effect of pH and Cl- concentration on the corrosion behavior and semiconductor properties of Cu2O in this paper. The polarization behavior of Cu electrodes and the stability of passive film Cu2O in boric acid buffer solution have been investigated respectively by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS) and semiconductor capacitance method (Mott-Schottky method). The results showed that the destruction and dissolution of the passive film Cu2O happened in the conditions of low pH and high Cl- concentration. The semiconductor character of passive film changed from p-type into n-type in the solution with high Cl- concentration, so that Cl- is more likely to enter the passive film and take complex reaction with Cu+, which could destroy the passive film and accelerate corrosion. The passive film Cu2O is more steady in the condition of high pH and low Cl- concentration.
Keywordgeological disposal of high level radioactive waste Cu2O passive film stability electrochemical impedance spectroscopy (EIS) Mott-Schottky method
Funding OrganizationNational Natural Science Foundation of China
DOI10.3724/SP.J.1037.2010.00440
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China[51071160]
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000289587300017
PublisherSCIENCE PRESS
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/104818
Collection中国科学院金属研究所
Corresponding AuthorDong Junhua
AffiliationChinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Wang Changgang,Dong Junhua,Ke Wei,et al. EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION[J]. ACTA METALLURGICA SINICA,2011,47(3):354-360.
APA Wang Changgang,Dong Junhua,Ke Wei,&Chen Nan.(2011).EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION.ACTA METALLURGICA SINICA,47(3),354-360.
MLA Wang Changgang,et al."EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION".ACTA METALLURGICA SINICA 47.3(2011):354-360.
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