EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION

doi:10.3724/SP.J.1037.2010.00440

IMR OpenIR

	EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION
	Wang Changgang; Dong Junhua; Ke Wei; Chen Nan
通讯作者	Dong Junhua(jhdong@imr.ac.cn)
	2011-03-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	47 期号:3 页码:354-360
摘要	The strategy for disposal of high-level radioactive waste in china is to enclose the spent nuclear fuel in sealed metal canisters which are embedded in bentonite clay hundreds meters deep in the bed-rock. The choice of container material depends largely on the redox conditions and the aqueous environment of the repository. One of the choices for the fabrication of waste canisters is copper, for it is thermodynamically stable under the saline, anoxic conditions over the large majority of the container lifetime. For this advantage, some other countries (Canada, Sweden) have selected copper as the material of nuclear waste container. However, in the early aerobic phase of the geological disposal the corrosion of copper could take place, and the corrosion behavior of copper would be influenced by the complex chemical conditions of groundwater markedly. Regularly, in atmosphere environment the semiconductor passive film which is constructed by Cu2O would generate on the surface of copper. On the one hand, the Cu2O film could protect copper from corrosion. On the other hand, the formation of Cu2O film is necessary to maintain the propagation of crack during the stress corrosion cracking. Therefore, the study of the effect of water chemistry conditions on the stability of Cu2O passive film makes great sense for the general corrosion and stress corrosion cracking of copper. For copper and copper alloy, Cl- is a highly aggressive ion. Lots of cases of failure and corrosion behavior of copper and copper alloy in Cl- environment have been studied. The immersion of Cl- would affect the semiconductor properties of Cu2O, therefore, we focused on the effect of pH and Cl- concentration on the corrosion behavior and semiconductor properties of Cu2O in this paper. The polarization behavior of Cu electrodes and the stability of passive film Cu2O in boric acid buffer solution have been investigated respectively by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS) and semiconductor capacitance method (Mott-Schottky method). The results showed that the destruction and dissolution of the passive film Cu2O happened in the conditions of low pH and high Cl- concentration. The semiconductor character of passive film changed from p-type into n-type in the solution with high Cl- concentration, so that Cl- is more likely to enter the passive film and take complex reaction with Cu+, which could destroy the passive film and accelerate corrosion. The passive film Cu2O is more steady in the condition of high pH and low Cl- concentration.
关键词	geological disposal of high level radioactive waste Cu2O passive film stability electrochemical impedance spectroscopy (EIS) Mott-Schottky method
资助者	National Natural Science Foundation of China
DOI	10.3724/SP.J.1037.2010.00440
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[51071160]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000289587300017
出版者	SCIENCE PRESS
引用统计	被引频次：5[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/104818
专题	中国科学院金属研究所
通讯作者	Dong Junhua
作者单位	Chinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Wang Changgang,Dong Junhua,Ke Wei,et al. EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION[J]. ACTA METALLURGICA SINICA,2011,47(3):354-360.
APA	Wang Changgang,Dong Junhua,Ke Wei,&Chen Nan.(2011).EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION.ACTA METALLURGICA SINICA,47(3),354-360.
MLA	Wang Changgang,et al."EFFCTS OF pH AND Cl- CONCENTRATION ON THE CORROSION BEHAVIOR OF COPPER IN BORIC ACID BUFFER SOLUTION".ACTA METALLURGICA SINICA 47.3(2011):354-360.