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Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites
Jin, P.; Xiao, B. L.; Wang, Q. Z.; Ma, Z. Y.; Liu, Y.; Li, S.
Corresponding AuthorMa, Z. Y.(zyma@imr.ac.cn)
2011-01-25
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume528Issue:3Pages:1504-1511
AbstractIn this study, the effect of solution temperature on artificial aging kinetics of 15 vol.% SiC particles reinforced 2009Al (SiCp/2009Al) composite prepared using a powder metallurgy method was investigated by means of microstructural examinations, hardness measurement and DSC analyses. The study indicated that, with increasing the solution temperature from 495 to 560 degrees C, while the GP zone formation and dissolution were retarded due to the decreased quenched-in vacancy concentration, the S' precipitation was promoted due to the increased dislocation density. This accelerated the aging kinetics of the composite with increasing the solution temperature from 495 to 560 degrees C. Furthermore, the composite which was solutionized at 530 degrees C exhibited the highest peak hardness and tensile strength. The effect of the solution temperature on the aging behavior and tensile properties of the composite was explained in terms of the variation of the microstructual mechanisms. (C) 2010 Elsevier B.V. All rights reserved.
KeywordComposites Aluminum alloys Aging Powder metallurgy Solution-treatment
DOI10.1016/j.msea.2010.10.075
Indexed BySCI
Language英语
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000286904300103
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:39[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/106749
Collection中国科学院金属研究所
Corresponding AuthorMa, Z. Y.
AffiliationChinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Jin, P.,Xiao, B. L.,Wang, Q. Z.,et al. Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2011,528(3):1504-1511.
APA Jin, P.,Xiao, B. L.,Wang, Q. Z.,Ma, Z. Y.,Liu, Y.,&Li, S..(2011).Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,528(3),1504-1511.
MLA Jin, P.,et al."Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 528.3(2011):1504-1511.
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