The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials

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	The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials
	Wang, YP ; Ding, BJ
通讯作者	Wang, YP()
	1999-09-01
发表期刊	IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN	1521-3331
卷号	22 期号:3 页码:467-472
摘要	The microcrystalline and nanocrystalline CuCr alloys prepared by high-energy ball milling and hot pressing were investigated in this paper. The experimental results show that the nanocrystalline Cu-Cr alloy powders are obtained by high energy ball milling, and the milled powders appear flaked or equiaxed morphology with or without liquid medium addition. The grain size of near fully dense alloys consolidated at 850 and 1200 K from milled powders is less than 100 nm and about 2-3 mu m, respectively. The ability to withstand high voltage of the nanocrystalline CuCr materials in vacuum is much higher than that of microcrystalline materials. The breakdown first takes place on the Cu-rich phase in the microcrystalline CuCr materials. For nanocrystalline CuCr materials, the breakdown exhibits diffusional feature, in which the are can move to the whole contact surface in a breakdown.
关键词	CuCr contacts microcrystalline nanocrystalline voltage withstand
收录类别	SCI
语种	英语
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS记录号	WOS:000083329100019
出版者	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
引用统计	被引频次：94[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/108865
专题	中国科学院金属研究所
通讯作者	Wang, YP
作者单位	1.Chinese Acad Sci, Inst Met Res, State Key Lab Rapidly Solidified NonEquilibrium A, Beijing, Peoples R China 2.Xian Jiao Tong Univ, State Key Lab Mech Behav Mat, Shanxi 710049, Peoples R China
推荐引用方式 GB/T 7714	Wang, YP,Ding, BJ. The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,1999,22(3):467-472.
APA	Wang, YP,&Ding, BJ.(1999).The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,22(3),467-472.
MLA	Wang, YP,et al."The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials".IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 22.3(1999):467-472.