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Creep-fatigue crack growth of intermetallic compound Ni3Al(B) at elevated temperatures
Zhang, GP; Wang, ZG
通讯作者Zhang, GP()
1999-11-01
发表期刊MATERIALS SCIENCE AND TECHNOLOGY
ISSN0267-0836
卷号15期号:11页码:1230-1235
摘要The creep-fatigue crack growth of Ni3Al(B) alloy was investigated at elevated temperatures in air under four different loading waveforms. Two types of time dependent damage mechanisms have been identified: oxidation and creep effects. As compared with fatigue crack growth in air at room temperature, the effect of oxidation at the crack tip on the crack growth acceleration is significant. Creep effects, on the other hand, are dominant for tensile holding and slow-fast loading waveforms. The complicated interaction between creep-fatigue, oxidation induced embrittlement, and oxide induced crack closure determined the different fatigue crack growth behaviours for different loading waveforms at elevated temperature. The relationship between the constants C and m in the Paris formula and loading waveform were examined, and the influence of loading waveform on the crack propagation were also discussed. MST/4260.
收录类别SCI
语种英语
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000083830900003
出版者INST MATERIALS
引用统计
被引频次:2[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/108968
专题中国科学院金属研究所
通讯作者Zhang, GP
作者单位Chinese Acad Sci, Met Res Inst, Fatigue & Fracture Mat Lab, Shenyang 110015, Peoples R China
推荐引用方式
GB/T 7714
Zhang, GP,Wang, ZG. Creep-fatigue crack growth of intermetallic compound Ni3Al(B) at elevated temperatures[J]. MATERIALS SCIENCE AND TECHNOLOGY,1999,15(11):1230-1235.
APA Zhang, GP,&Wang, ZG.(1999).Creep-fatigue crack growth of intermetallic compound Ni3Al(B) at elevated temperatures.MATERIALS SCIENCE AND TECHNOLOGY,15(11),1230-1235.
MLA Zhang, GP,et al."Creep-fatigue crack growth of intermetallic compound Ni3Al(B) at elevated temperatures".MATERIALS SCIENCE AND TECHNOLOGY 15.11(1999):1230-1235.
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