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Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach
Lu, K; Lu, J
Corresponding AuthorLu, K(kelu@imr.ac.cn)
1999-05-01
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume15Issue:3Pages:193-197
AbstractIn this paper, a concept of surface nanocrystallization (SNC) of metallic materials is introduced. Three types of SNC processes are classified. Different SNC mechanisms and possible techniques for SNC are discussed with emphasis on mechanically induced surface self-nanocrystallization. Further development and prospects are addressed with respect to the properties and behaviors of the materials with a nanocrystalline surface. Enhancement of the behavior of the engineering materials by means of the SNC technology and its industrial application possibilities are analyzed.
Indexed BySCI
Language英语
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000080601900002
PublisherJOURNAL MATER SCI TECHNOL
Citation statistics
Cited Times:573[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/109427
Collection中国科学院金属研究所
Corresponding AuthorLu, K
Affiliation1.Chinese Acad Sci, Met Res Inst, State Key Lab RSA, Shenyang 110015, Peoples R China
2.Univ Technol Troyes, LASMIS, F-10000 Troyes, France
Recommended Citation
GB/T 7714
Lu, K,Lu, J. Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,1999,15(3):193-197.
APA Lu, K,&Lu, J.(1999).Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,15(3),193-197.
MLA Lu, K,et al."Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 15.3(1999):193-197.
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