Low temperature creep of nanocrystalline pure copper

IMR OpenIR

	Low temperature creep of nanocrystalline pure copper
	Cai, B ; Kong, QP ; Lu, L ; Lu, K
通讯作者	Kong, QP()
	2000-06-30
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	286 期号:1 页码:188-192
摘要	Tensile creep of nano-grained pure Cu with an average grain size of 30 mm prepared by electrodeposition technique has been investigated in the temperature range 20-50 degrees C (0.22-0.24 T-m). The steady state creep rate is found to be proportional to the effective stress sigma(e) = (sigma - sigma(0)), where sigma is the applied stress, and sigma(0) is the threshold stress. The activation energy for the creep is measured to be 0.72 eV, which is close to that for grain boundary diffusion in nano-grained Cu. The creep rates are found to be of the same order of magnitude as those calculated from the equation for Coble creep. The existence of threshold stress implies that the grain boundaries do not act as perfect sources and sinks of atoms (or vacancies). The results suggest that the creep can be attributed to the 'interface controlled diffusional creep'. (C) 2000 Elsevier Science S.A. All rights reserved.
关键词	nanocrystalline materials creep grain boundary diffusion
收录类别	SCI
语种	英语
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000088914700034
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：94[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/111308
专题	中国科学院金属研究所
通讯作者	Kong, QP
作者单位	1.Chinese Acad Sci, Inst Solid State Phys, Internal Frict & Defects Solids Lab, Hefei 230031, Peoples R China 2.Chinese Acad Sci, Inst Mat Res, State Key Lab RSA, Shenyang 110015, Peoples R China
推荐引用方式 GB/T 7714	Cai, B,Kong, QP,Lu, L,et al. Low temperature creep of nanocrystalline pure copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2000,286(1):188-192.
APA	Cai, B,Kong, QP,Lu, L,&Lu, K.(2000).Low temperature creep of nanocrystalline pure copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,286(1),188-192.
MLA	Cai, B,et al."Low temperature creep of nanocrystalline pure copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 286.1(2000):188-192.