| Low temperature creep of nanocrystalline pure copper | |
| Cai, B; Kong, QP; Lu, L; Lu, K | |
| Corresponding Author | Kong, QP() |
| 2000-06-30 | |
| Source Publication | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
 |
| ISSN | 0921-5093 |
| Volume | 286Issue:1Pages:188-192 |
| Abstract | Tensile creep of nano-grained pure Cu with an average grain size of 30 mm prepared by electrodeposition technique has been investigated in the temperature range 20-50 degrees C (0.22-0.24 T-m). The steady state creep rate is found to be proportional to the effective stress sigma(e) = (sigma - sigma(0)), where sigma is the applied stress, and sigma(0) is the threshold stress. The activation energy for the creep is measured to be 0.72 eV, which is close to that for grain boundary diffusion in nano-grained Cu. The creep rates are found to be of the same order of magnitude as those calculated from the equation for Coble creep. The existence of threshold stress implies that the grain boundaries do not act as perfect sources and sinks of atoms (or vacancies). The results suggest that the creep can be attributed to the 'interface controlled diffusional creep'. (C) 2000 Elsevier Science S.A. All rights reserved. |
| Keyword | nanocrystalline materials creep grain boundary diffusion |
| Indexed By | SCI |
| Language | 英语 |
| WOS Research Area | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000088914700034 |
| Publisher | ELSEVIER SCIENCE SA |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/111308 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Kong, QP |
| Affiliation | 1.Chinese Acad Sci, Inst Solid State Phys, Internal Frict & Defects Solids Lab, Hefei 230031, Peoples R China 2.Chinese Acad Sci, Inst Mat Res, State Key Lab RSA, Shenyang 110015, Peoples R China |
| Recommended Citation GB/T 7714 | Cai, B,Kong, QP,Lu, L,et al. Low temperature creep of nanocrystalline pure copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2000,286(1):188-192. |
| APA | Cai, B,Kong, QP,Lu, L,&Lu, K.(2000).Low temperature creep of nanocrystalline pure copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,286(1),188-192. |
| MLA | Cai, B,et al."Low temperature creep of nanocrystalline pure copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 286.1(2000):188-192. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment