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Low temperature creep of nanocrystalline pure copper
Cai, B; Kong, QP; Lu, L; Lu, K
Corresponding AuthorKong, QP()
2000-06-30
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume286Issue:1Pages:188-192
AbstractTensile creep of nano-grained pure Cu with an average grain size of 30 mm prepared by electrodeposition technique has been investigated in the temperature range 20-50 degrees C (0.22-0.24 T-m). The steady state creep rate is found to be proportional to the effective stress sigma(e) = (sigma - sigma(0)), where sigma is the applied stress, and sigma(0) is the threshold stress. The activation energy for the creep is measured to be 0.72 eV, which is close to that for grain boundary diffusion in nano-grained Cu. The creep rates are found to be of the same order of magnitude as those calculated from the equation for Coble creep. The existence of threshold stress implies that the grain boundaries do not act as perfect sources and sinks of atoms (or vacancies). The results suggest that the creep can be attributed to the 'interface controlled diffusional creep'. (C) 2000 Elsevier Science S.A. All rights reserved.
Keywordnanocrystalline materials creep grain boundary diffusion
Indexed BySCI
Language英语
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000088914700034
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:81[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/111308
Collection中国科学院金属研究所
Corresponding AuthorKong, QP
Affiliation1.Chinese Acad Sci, Inst Solid State Phys, Internal Frict & Defects Solids Lab, Hefei 230031, Peoples R China
2.Chinese Acad Sci, Inst Mat Res, State Key Lab RSA, Shenyang 110015, Peoples R China
Recommended Citation
GB/T 7714
Cai, B,Kong, QP,Lu, L,et al. Low temperature creep of nanocrystalline pure copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2000,286(1):188-192.
APA Cai, B,Kong, QP,Lu, L,&Lu, K.(2000).Low temperature creep of nanocrystalline pure copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,286(1),188-192.
MLA Cai, B,et al."Low temperature creep of nanocrystalline pure copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 286.1(2000):188-192.
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