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Effects of annealing time and Si cap layer thickness on the Si/SiGe/Si heterostructures thermal stability
Gao, F; Lin, YX; Huang, DD; Li, JP; Sun, DZ; Kong, MY; Zeng, YP; Li, JM; Lin, LY
Corresponding AuthorGao, F()
2001-07-01
Source PublicationJOURNAL OF CRYSTAL GROWTH
ISSN0022-0248
Volume227Pages:766-769
AbstractThe effects of annealing time and Si cap layer thickness: on the thermal stability of the Si/SiGe/Si heterostructures deposited by disilane and solid-Ge molecule beam epitaxy were investigated. It is found that in the same strain state of the SiGe layers the annealing time decreases with increasing Si cap layer thickness. This effect is analyzed by a force-balance theory and an equation has been obtained to characterize the relation between the annealing time and the Si cap layer thickness. (C) 2001 Elsevier Science B.V. All rights reserved.
Keywordannealing molecular beam epitaxy germanium silicon alloys semiconducting materials
Indexed BySCI
Language英语
WOS Research AreaCrystallography ; Materials Science ; Physics
WOS SubjectCrystallography ; Materials Science, Multidisciplinary ; Physics, Applied
WOS IDWOS:000169557600148
PublisherELSEVIER SCIENCE BV
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/111739
Collection中国科学院金属研究所
Corresponding AuthorGao, F
AffiliationChinese Acad Sci, Ctr Mat Sci, Inst Semicond, Beijing 10083, Peoples R China
Recommended Citation
GB/T 7714
Gao, F,Lin, YX,Huang, DD,et al. Effects of annealing time and Si cap layer thickness on the Si/SiGe/Si heterostructures thermal stability[J]. JOURNAL OF CRYSTAL GROWTH,2001,227:766-769.
APA Gao, F.,Lin, YX.,Huang, DD.,Li, JP.,Sun, DZ.,...&Lin, LY.(2001).Effects of annealing time and Si cap layer thickness on the Si/SiGe/Si heterostructures thermal stability.JOURNAL OF CRYSTAL GROWTH,227,766-769.
MLA Gao, F,et al."Effects of annealing time and Si cap layer thickness on the Si/SiGe/Si heterostructures thermal stability".JOURNAL OF CRYSTAL GROWTH 227(2001):766-769.
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