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Wetting behaviors of liquid Zr55Al10Ni5Cu30 and W substrate
Qiao, DC; Zhang, HF; Li, H; Li, H; Ding, BZ; Hu, ZQ
Corresponding AuthorQiao, DC()
2003-10-01
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume39Issue:10Pages:1076-1080
AbstractBy sessile drop technique the wetting behaviors of molten Zr55Al10Ni5Cu30 on W substrate have been studied during heating continuously and holding for 20 min at different temperatures. The results show that the higher the temperature, the smaller the contact angle, and the larger the wetting radius. The wetting process is finished in about 6 min. The wetting process during heating continuously is divided into: incubation, metastable and stable stages. The iso-temperature wetting process at the temperature range from 1173 to 1223 K consists of metastable and stable stages. The wetting behaviors between Zr55Al10Ni5Cu30 and W belong to reactive wetting, and W dissolves and diffuses at the interface. Choosing the appropriate processing technique and controlling the reaction at the interface are necessary for preparing the W-reinforced Zr55Al10Ni5Cu30 bulk metal glass.
KeywordZr55Al10Ni5CU30 alloy wetting interface reaction
Indexed BySCI
Language英语
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000186451300013
PublisherSCIENCE CHINA PRESS
Citation statistics
Cited Times:7[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/116086
Collection中国科学院金属研究所
Corresponding AuthorQiao, DC
AffiliationChinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Qiao, DC,Zhang, HF,Li, H,et al. Wetting behaviors of liquid Zr55Al10Ni5Cu30 and W substrate[J]. ACTA METALLURGICA SINICA,2003,39(10):1076-1080.
APA Qiao, DC,Zhang, HF,Li, H,Li, H,Ding, BZ,&Hu, ZQ.(2003).Wetting behaviors of liquid Zr55Al10Ni5Cu30 and W substrate.ACTA METALLURGICA SINICA,39(10),1076-1080.
MLA Qiao, DC,et al."Wetting behaviors of liquid Zr55Al10Ni5Cu30 and W substrate".ACTA METALLURGICA SINICA 39.10(2003):1076-1080.
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