Oxidation behavior of Cu-Cr alloys prepared by different techniques | |
Fu, GY; Niu, Y; Wu, WT | |
Corresponding Author | Fu, GY() |
2003-03-11 | |
Source Publication | ACTA METALLURGICA SINICA
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ISSN | 0412-1961 |
Volume | 39Issue:3Pages:297-300 |
Abstract | The oxidation behaviors of Cu-Cr alloys prepared by powder metallurgy (PM Cu-25Cr), mechanically alloying (MA Cu-20Cr) and magnetron sputtering (MS Cu-20Cr) techniques in 0.1 MPa O-2 at 700 degreesC were investigated. A complex scale composing of CuO, Cu2O, CuCr2O4 and Cr2O3 formed on the PM Cu-25Cr alloy, a continuous Cr2O3 layer beneath a complex scale appeared on the MA Cu-20Cr, but MS Cu-20Cr produced a simple scale including outer layer CuO and inner layer Cr2O3. The mass gain of MS Cu-20Cr is less than that of MA Cu-20Cr, and their mass gains are much less than that of the PM Cu-25Cr. Fined level of the microstructure has a significant effect on their oxidation behaviors in binary two-phase Cu-Cr alloys. |
Keyword | binary two-phase alloy microstructure oxidation |
Indexed By | SCI |
Language | 英语 |
WOS Research Area | Metallurgy & Metallurgical Engineering |
WOS Subject | Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000182216200015 |
Publisher | SCIENCE CHINA PRESS |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/117571 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Fu, GY |
Affiliation | 1.Shenyang Inst Chem Technol, Dept Engn Mech, Shenyang 110142, Peoples R China 2.Chinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110016, Peoples R China |
Recommended Citation GB/T 7714 | Fu, GY,Niu, Y,Wu, WT. Oxidation behavior of Cu-Cr alloys prepared by different techniques[J]. ACTA METALLURGICA SINICA,2003,39(3):297-300. |
APA | Fu, GY,Niu, Y,&Wu, WT.(2003).Oxidation behavior of Cu-Cr alloys prepared by different techniques.ACTA METALLURGICA SINICA,39(3),297-300. |
MLA | Fu, GY,et al."Oxidation behavior of Cu-Cr alloys prepared by different techniques".ACTA METALLURGICA SINICA 39.3(2003):297-300. |
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