A new Cu matrix composite was developed utilizing layered ternary Ti2SnC ceramic as reinforcement. The Cu/Ti2SnC composites with different volume percent of Ti2SnC were prepared by the powder metallurgy method, and the effect of Ti2SnC content on microstructure, hardness and tensile strength of the composites were investigated. The results demonstrate that Ti2SnC is an effective reinforcement for Cu. The Cu-20% (volume fraction) Ti2SnC has yield and ultimate strengths of 319 MPa and 440 MPa, respectively, which is 4 and 2 times that of pure Cu, while the elongation keeps at 12%. The main mechanisms for the strengthening of Cu are grain refinement and dislocation pile-up.