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Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath
Qiao, M; Xian, AP; Shang, JK
Corresponding AuthorXian, AP()
2004-08-01
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume40Issue:8Pages:822-826
AbstractIn the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.
Keywordlead-free solder electroplating Sn-Ag alloy microelectronic packaging
Indexed BySCI
Language英语
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000223695400008
PublisherSCIENCE CHINA PRESS
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/119018
Collection中国科学院金属研究所
Corresponding AuthorXian, AP
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Recommended Citation
GB/T 7714
Qiao, M,Xian, AP,Shang, JK. Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath[J]. ACTA METALLURGICA SINICA,2004,40(8):822-826.
APA Qiao, M,Xian, AP,&Shang, JK.(2004).Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath.ACTA METALLURGICA SINICA,40(8),822-826.
MLA Qiao, M,et al."Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath".ACTA METALLURGICA SINICA 40.8(2004):822-826.
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