Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath

IMR OpenIR

	Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath
	Qiao, M ; Xian, AP ; Shang, JK
通讯作者	Xian, AP()
	2004-08-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	40 期号:8 页码:822-826
摘要	In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.
关键词	lead-free solder electroplating Sn-Ag alloy microelectronic packaging
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000223695400008
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/119018
专题	中国科学院金属研究所
通讯作者	Xian, AP
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Qiao, M,Xian, AP,Shang, JK. Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath[J]. ACTA METALLURGICA SINICA,2004,40(8):822-826.
APA	Qiao, M,Xian, AP,&Shang, JK.(2004).Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath.ACTA METALLURGICA SINICA,40(8),822-826.
MLA	Qiao, M,et al."Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath".ACTA METALLURGICA SINICA 40.8(2004):822-826.