Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate

IMR OpenIR

	Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate
	Qin, M ; Ji, V ; Li, JB ; Ma, SY ; Chen, CR ; Song, ZX ; He, JW
通讯作者	Qin, M(mqin@imr.ac.cn)
	2004-07-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	40 期号:7 页码:716-720
摘要	Using X-ray tensile test, the relationship between the yield strength and annealing temperature for a Cu film with biaxial residual stress adherent to substrate was investigated. The results indicate that the proof stress of the film decreases with increasing annealing temperature. When annealing temperature rose from 150 degreesC to 300 degreesC, the decreasing amplitude of proof stress is the largest. The reason of this phenomenon is that recrystallization in film occurred at 300 degreesC, and a majority of structure strengthening effects disappeared. The yield strength of the Cu film on the steel substrate is greatly higher than that of block Cu.
关键词	Cu film biaxial stress yield strength annealing temperature X-ray tensile test
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000222938000008
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/119690
专题	中国科学院金属研究所
通讯作者	Qin, M
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Ecole Natl Super Arts & Metiers, LM3 ESA CNRS 8006, F-75013 Paris, France 3.Xian Jiaotong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
推荐引用方式 GB/T 7714	Qin, M,Ji, V,Li, JB,et al. Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate[J]. ACTA METALLURGICA SINICA,2004,40(7):716-720.
APA	Qin, M.,Ji, V.,Li, JB.,Ma, SY.,Chen, CR.,...&He, JW.(2004).Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate.ACTA METALLURGICA SINICA,40(7),716-720.
MLA	Qin, M,et al."Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate".ACTA METALLURGICA SINICA 40.7(2004):716-720.