IMR OpenIR
Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding
Zhang, Jian Yang1; Sun, Ming Yue2; Xu, Bin2; Li, Dian Zhong2
Corresponding AuthorSun, Ming Yue(mysun@imr.ac.cn)
2018-10-01
Source PublicationMETALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE
ISSN1073-5615
Volume49Issue:5Pages:2152-2162
AbstractThe novel metallurgical joining process for bonding IN718 superalloy was investigated by hot compressive bonding (HCB) process under the deformation temperature range of 1000 A degrees C to 1150 A degrees C and true strains ranging from 0 to 0.5 at a strain rate of 0.001 s(-1). The effect of HCB process parameters on the tensile strength was analyzed. Both the as-deformed and the interfacial microstructures were characterized using the optical microscope, electron backscattered diffraction and transmission electron microscope (TEM) analysis. The results of tensile property revealed that the degree of metallurgical bonding is promoted by increasing deformation temperature and strain. The evolution of the interfacial microstructure showed that the migration of interfacial grain boundary (IGB), which is characterized by discontinuous dynamic recrystallization, is the dominant metallurgical bonding mechanism in the early stages of bonding. TEM analysis indicated that the dislocation density is distributed heterogeneously over both sides of IGB, which is the significant reason for the migration of IGB, during the initial stage of HCB process.
DOI10.1007/s11663-018-1313-9
Indexed BySCI
Language英语
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000444765500003
PublisherSPRINGER
Citation statistics
Cited Times:9[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/129527
Collection中国科学院金属研究所
Corresponding AuthorSun, Ming Yue
Affiliation1.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Zhang, Jian Yang,Sun, Ming Yue,Xu, Bin,et al. Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding[J]. METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE,2018,49(5):2152-2162.
APA Zhang, Jian Yang,Sun, Ming Yue,Xu, Bin,&Li, Dian Zhong.(2018).Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding.METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE,49(5),2152-2162.
MLA Zhang, Jian Yang,et al."Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding".METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE 49.5(2018):2152-2162.
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