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Evolution of the interfacial microstructure during the plastic deformation bonding of copper
Zhang, Jian Yang1,2; Sun, Ming Yue1,3,4; Xu, Bin1,3,4; Hu, Xin5; Liu, Sheng1,2; Xie, Bi Jun1,2; Li, Dian Zhong1,3
Corresponding AuthorSun, Ming Yue(mysun@imr.ac.cn)
2019-02-11
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume746Pages:1-10
AbstractIn order to clarify the bonding mechanism by plastic deformation of two similar materials, the microstructural evolution of the copper-copper interface by hot compression was investigated in detail. Particular attention was given to the development of new recrystallized grains in the bonding area and the elimination of the bonding line by the migration of interfacial grain boundaries (IGBs) during the hot compression process. The evolution of new grains in the matrix and the interface occur via different types of dynamic recrystallization (DRX). The former is associated with the grain boundary bulging and the latter is related to a strain induced substructure. This substructure is composed of a dislocation wall, and is transformed into recrystallized grain by the evolution of high angular misorientations after increasing strain. Two types of interfaces with different grain size features, such as a fine-fine grain or a fine-coarse grain interface, will be generated owing to different degrees of re crystallization occurring at the interface. The bonding mechanisms of the two different structural interfaces are also discussed.
KeywordCopper bonding Hot compression bonding Dynamic recrystallization Grain boundary Dislocation wall
Funding OrganizationNational Key Research and Development Program ; National Natural Science Foundation of China ; Key Program of the Chinese Academy of Sciences
DOI10.1016/j.msea.2018.12.119
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program[2016YFB0300401] ; National Natural Science Foundation of China[U1508215] ; National Natural Science Foundation of China[51774265] ; Key Program of the Chinese Academy of Sciences[ZDRW-CN-2017-1]
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000458227900001
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:10[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/131520
Collection中国科学院金属研究所
Corresponding AuthorSun, Ming Yue
Affiliation1.Chinese Acad Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
3.Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
4.Chinese Acad Sci, Key Lab Nucl Mat & Safety Assessment, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
5.Yanshan Univ, Sch Mech Engn, 438 HeBei Rd, Qinhuangdao 066004, Peoples R China
Recommended Citation
GB/T 7714
Zhang, Jian Yang,Sun, Ming Yue,Xu, Bin,et al. Evolution of the interfacial microstructure during the plastic deformation bonding of copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,746:1-10.
APA Zhang, Jian Yang.,Sun, Ming Yue.,Xu, Bin.,Hu, Xin.,Liu, Sheng.,...&Li, Dian Zhong.(2019).Evolution of the interfacial microstructure during the plastic deformation bonding of copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,746,1-10.
MLA Zhang, Jian Yang,et al."Evolution of the interfacial microstructure during the plastic deformation bonding of copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 746(2019):1-10.
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