| Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics | |
| Li, Cai-Fu1; Li, Wanli1,2; Zhang, Hao1; Liu, Jinting1,3; Yang, Yang1,4; Li, Lingying1,2; Gao, Yue1,2; Liu, Zhi-Quan1,5; Suganuma, Katsuaki1 | |
| 通讯作者 | Li, Cai-Fu(licf@alum.imr.ac.cn) |
| 2019-01-23 | |
| 发表期刊 | ACS APPLIED MATERIALS & INTERFACES
 |
| ISSN | 1944-8244 |
| 卷号 | 11期号:3页码:3231-3240 |
| 摘要 | Stretchable wiring and stretchable bonding between a rigid chip/component and a stretchable substrate are two key factors for stretchable electronics. In this study, a highly conductive stretchable paste has been developed with commercial Ag microflakes and poly(dimethylsiloxane), which can be used to fabricate stretchable wirings and bondings under a low curing temperature of 100 degrees C with printing method. Herein, recoverabilities as to recovery time and recovery resistance of the wirings are defined and discussed. The effect of Ag composition and the tensile strain rate on the recoverability of the wirings are also examined. The wiring with a low resistivity of 8.7 x 10(-5) Omega cm shows much better recoverability than nanowire-based wirings due to the flake nature of the Ag particles. When stretched to 50 and 100% of strain, the resistance of the patterned wiring increases by only 10 and 110%, respectively. Moreover, the resistance of the wiring during 20% tensile cyclic test remains within 1.1 times even after 1000 cycles, thus demonstrating significant durability. The paste was utilized to fabricate conductive tracks and stretchable bondings to assemble a rigid chip to fabricate a stretchable demo. When stretched to 50% of strain, resistance of the wiring was increased by 90%. It is anticipated that the newly developed paste will be used to fabricate various stretchable wirings, bondings, and packaging structures by a simple printing process, thus enabling mass production of stretchable electronic devices. |
| 关键词 | conductive pastes stretchable wirings stretchable bonding Ag microflakes recoverability |
| 资助者 | Huawei Innovation Research Program ; Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials from the Ministry of Education, Culture, Sports, Science and Technology of Japan ; JSPS ; Osaka University Visiting Scholar Program |
| DOI | 10.1021/acsami.8b19069 |
| 收录类别 | SCI |
| 语种 | 英语 |
| 资助项目 | Huawei Innovation Research Program ; Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials from the Ministry of Education, Culture, Sports, Science and Technology of Japan ; JSPS[JP17K14824] ; JSPS[PE17020] ; Osaka University Visiting Scholar Program[J135104902] |
| WOS研究方向 | Science & Technology - Other Topics ; Materials Science |
| WOS类目 | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary |
| WOS记录号 | WOS:000457067300077 |
| 出版者 | AMER CHEMICAL SOC |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/131677 |
| 专题 | 中国科学院金属研究所 |
| 通讯作者 | Li, Cai-Fu |
| 作者单位 | 1.Osaka Univ, Inst Sci & Ind Res, Ibaraki 5670047, Japan 2.Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Suita, Osaka 5650871, Japan 3.Senju Met Ind Co Ltd, Tokyo 1208555, Japan 4.Pacific Northwest Natl Lab, Richland, WA 99354 USA 5.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li, Cai-Fu,Li, Wanli,Zhang, Hao,et al. Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics[J]. ACS APPLIED MATERIALS & INTERFACES,2019,11(3):3231-3240. |
| APA | Li, Cai-Fu.,Li, Wanli.,Zhang, Hao.,Liu, Jinting.,Yang, Yang.,...&Suganuma, Katsuaki.(2019).Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics.ACS APPLIED MATERIALS & INTERFACES,11(3),3231-3240. |
| MLA | Li, Cai-Fu,et al."Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics".ACS APPLIED MATERIALS & INTERFACES 11.3(2019):3231-3240. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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