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Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
Authors:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
Favorite  |  View/Download:0/0  |  Submit date:2021/10/15
Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation  
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
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The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
Authors:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
Favorite  |  View/Download:16/0  |  Submit date:2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism  
Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters 期刊论文
JOURNAL OF MICROSCOPY, 2020, 卷号: 279, 期号: 3, 页码: 212-216
Authors:  Robertson, Stuart;  Doak, Scott;  Sun, Fu-Long;  Liu, Zhi-Quan;  Liu, Changqing;  Zhou, Zhaoxia
Favorite  |  View/Download:10/0  |  Submit date:2021/02/02
Chunk lift-out  focused ion beam  in situ  micromechanical testing  nanotwinned copper  P-FIB  
The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
Authors:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
Favorite  |  View/Download:9/0  |  Submit date:2021/02/02
AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download:7/0  |  Submit date:2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download:7/0  |  Submit date:2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
Authors:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
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Cu-Sn IMC  Growth behavior  External stress effect  Isothermal aging  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
Authors:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
Favorite  |  View/Download:9/0  |  Submit date:2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
Authors:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
Favorite  |  View/Download:7/0  |  Submit date:2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point