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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
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Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
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Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
Authors:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
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Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 19, 页码: 17915-17924
Authors:  Yuan, Jie;  Qian, Xitang;  Meng, Zhichao;  Yang, Bo;  Liu, Zhi-Quan
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hexagonal boron nitride nanosheets (hBNNs)  magnetic FeCo nanocubes  electrostatic interactions  vertically orientation  thermal conductivity  
Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 3, 页码: 3231-3240
Authors:  Li, Cai-Fu;  Li, Wanli;  Zhang, Hao;  Liu, Jinting;  Yang, Yang;  Li, Lingying;  Gao, Yue;  Liu, Zhi-Quan;  Suganuma, Katsuaki
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conductive pastes  stretchable wirings  stretchable bonding  Ag microflakes  recoverability  
FCBGA器件SnAgCu焊点的热冲击可靠性分析 期刊论文
焊接学报, 2019, 卷号: 40, 期号: 09, 页码: 39-42+162
Authors:  姜楠;  张亮;  刘志权;  熊明月;  龙伟民
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有限元法  热冲击  焊点  可靠性  疲劳寿命  
一种从锡铝合金表面可控制备单晶锡纳米线/微米线的方法 专利
专利类型: 发明专利, 专利号: 201510789340.1, 申请日期: 2018-08-14,
Authors:  李财富;  刘志权
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