Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

doi:10.1007/s10854-020-04982-4

IMR OpenIR

	Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
	Chen, Yinbo 1,2; Meng, Zhi-Chao 1,2; Gao, Li-Yin 3; Liu, Zhi-Quan 1,3
通讯作者	Liu, Zhi-Quan(zqliu@siat.ac.cn)
	2021
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
页码	15
摘要	To optimize the mechanical properties of low-Ag lead-free solder, different amount of Bi element was added into the Sn-1.0Ag-0.5Cu (SAC105) to form SAC105-xBi (0 <= x <= 4) solder alloy. The microstructural evolution and shear fracture of SAC105-xBi solder joints were systematically investigated to clarify the failure mechanism after reflow and after 175 degrees C aging compared to SAC305. It was found that Bi element could provide solution strengthening and second-phase strengthening in the low-Ag SAC solder joints depending on the amount of added Bi element. The shear strength after reflow increased from 34.79 to 70.16 MPa with the increase of Bi addition from x = 0.0 to x = 4.0, while that after aging at 175 degrees C for 168 h increased from 28.97 MPa (x = 0.0) to 55.02 MPa (x = 4.0). The thickness of IMC decreased with the addition of Bi, and excessive Bi would precipitate in the matrix when the Bi content reached 2 wt% or even form brittle Bi barrier layer after 4 wt% addition. During shear tests, three kinds of fracture mode including ductile fracture, quasi-cleavage fracture, and cleavage brittle fracture were observed, and three kinds of failure position including solder matrix, Cu6Sn5/solder interface, and Cu3Sn/Cu interface were revealed. The failure mechanism of different solder joints was closely related to the coupling effects among the Bi amount in the matrix, the thicknesses of IMC, and the status of Kirkendall voids, which significantly affected the reliability of SAC solder joints. Finally, SAC105-1.0Bi solder alloy was considered having the most suitable Bi addition with anticipated comprehensive properties compared with SAC305.
资助者	National Key R&D Program of China
DOI	10.1007/s10854-020-04982-4
收录类别	SCI
语种	英语
资助项目	National Key R&D Program of China[2017YFB0305700]
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000604092100027
出版者	SPRINGER
引用统计	被引频次：30[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/158937
专题	中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
推荐引用方式 GB/T 7714	Chen, Yinbo,Meng, Zhi-Chao,Gao, Li-Yin,et al. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021:15.
APA	Chen, Yinbo,Meng, Zhi-Chao,Gao, Li-Yin,&Liu, Zhi-Quan.(2021).Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,15.
MLA	Chen, Yinbo,et al."Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021):15.