Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling

doi:10.1007/s10854-021-07395-z

IMR OpenIR

	Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling
	Chen, Yinbo 1,2; Wang, Changchang 1,2; Gao, Yue 3; Gao, Zhaoqing 4; Liu, Zhi-Quan 1,2,3
通讯作者	Liu, Zhi-Quan(zgliu@siat.ac.cn)
	2021-11-20
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
页码	11
摘要	Although many studies have reported the behaviors of thermal cycling of Sn-based solder joints, the corresponding mechanism is difficult to describe universally due to the complexity of different cases. In the present study, microstructural evolution and failure of Sn-Bi57-Ag0.7 solder joints caused by thermal cycling between - 40 and 85 degrees C from 0 to 1000 cycles were systematically investigated. The results indicated that the Sn-Bi-Ag solder joint was composed of Sn-rich phase, Bi-rich phase, large numbers of Bi dispersed-particles, and Ag3Sn precipitate. With the extension of time during thermal cycling, the microstructure of Sn-Bi-Ag solder joint gradually coarsened and the IMC layer became thicker (from 0.82 to 2.38 mu m). However, Sn-Bi-Ag solder joints failed after 3000 thermal cycles. Two different stages of failure were found and the mechanism, related to the increment of thermal mismatch stress, was illuminated. Furthermore, Electron Backscattered Diffraction was used to detailedly elucidate the grain characteristics of the failed Sn-Bi-Ag solder joints, and the effect of thermal stress on orientations of Sn and Bi grains was also revealed. Being different from the orientation change observed in traditional Sn-Bi eutectic solder joints in previous studies, the present results demonstrated that both Sn and Bi grains did not present any preferred orientations after thermal cycling. And the reason of this phenomenon might be attributed to the Ag3Sn, which could be regarded as second-phase particles. Our present work would provide theoretical guidance for the development of new Sn-Bi-X solders with high reliabilities.
DOI	10.1007/s10854-021-07395-z
收录类别	SCI
语种	英语
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000720707500003
出版者	SPRINGER
引用统计	被引频次：11[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/167397
专题	中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China 4.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
推荐引用方式 GB/T 7714	Chen, Yinbo,Wang, Changchang,Gao, Yue,et al. Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021:11.
APA	Chen, Yinbo,Wang, Changchang,Gao, Yue,Gao, Zhaoqing,&Liu, Zhi-Quan.(2021).Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,11.
MLA	Chen, Yinbo,et al."Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021):11.