| Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling | |
| Chen, Yinbo1,2; Wang, Changchang1,2; Gao, Yue3; Gao, Zhaoqing4; Liu, Zhi-Quan1,2,3 | |
| Corresponding Author | Liu, Zhi-Quan(zgliu@siat.ac.cn) |
| 2021-11-20 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Pages | 11 |
| Abstract | Although many studies have reported the behaviors of thermal cycling of Sn-based solder joints, the corresponding mechanism is difficult to describe universally due to the complexity of different cases. In the present study, microstructural evolution and failure of Sn-Bi57-Ag0.7 solder joints caused by thermal cycling between - 40 and 85 degrees C from 0 to 1000 cycles were systematically investigated. The results indicated that the Sn-Bi-Ag solder joint was composed of Sn-rich phase, Bi-rich phase, large numbers of Bi dispersed-particles, and Ag3Sn precipitate. With the extension of time during thermal cycling, the microstructure of Sn-Bi-Ag solder joint gradually coarsened and the IMC layer became thicker (from 0.82 to 2.38 mu m). However, Sn-Bi-Ag solder joints failed after 3000 thermal cycles. Two different stages of failure were found and the mechanism, related to the increment of thermal mismatch stress, was illuminated. Furthermore, Electron Backscattered Diffraction was used to detailedly elucidate the grain characteristics of the failed Sn-Bi-Ag solder joints, and the effect of thermal stress on orientations of Sn and Bi grains was also revealed. Being different from the orientation change observed in traditional Sn-Bi eutectic solder joints in previous studies, the present results demonstrated that both Sn and Bi grains did not present any preferred orientations after thermal cycling. And the reason of this phenomenon might be attributed to the Ag3Sn, which could be regarded as second-phase particles. Our present work would provide theoretical guidance for the development of new Sn-Bi-X solders with high reliabilities. |
| DOI | 10.1007/s10854-021-07395-z |
| Indexed By | SCI |
| Language | 英语 |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| WOS ID | WOS:000720707500003 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/167397 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Liu, Zhi-Quan |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China 4.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China |
| Recommended Citation GB/T 7714 | Chen, Yinbo,Wang, Changchang,Gao, Yue,et al. Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021:11. |
| APA | Chen, Yinbo,Wang, Changchang,Gao, Yue,Gao, Zhaoqing,&Liu, Zhi-Quan.(2021).Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,11. |
| MLA | Chen, Yinbo,et al."Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021):11. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment