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A new quantizing insulator soldering technology scheme for microwave module
Tian, Fei-Fei1,2; Zhou, Ming1; Zhang, Jun Zhi1
Corresponding AuthorTian, Fei-Fei(fftian@alum.imr.ac.cn)
2019-04-01
Source PublicationMICROWAVE AND OPTICAL TECHNOLOGY LETTERS
ISSN0895-2477
Volume61Issue:4Pages:979-984
AbstractA new quantizing technology scheme of insulator soldering was presented comparing with traditional soldering technology using solder paste, based on utilization of solid solder ring and the consideration of insulator mounting hole design on the microwave module shell. The X-ray test on void ratio of insulator soldering shows that there exists no penetration void and the void ratio is below 5%. According to the leak standard A4 of GJB 548B-1014.2, the standard leak rate of microwave module after the insulator soldering was below 5 x 10(-9)(Pa center dot m(3))/s. After 10 cycles of temperature shock test ranging from -55 degrees C to 125 degrees C, the standard leak rate of microwave module was still below 5 x 10(-9) (Pa center dot m(3))/s. In comparison with traditional insulator soldering technology using solder paste, through utilization of solid solder ring and the design of insulator mounting hole, this new technology quantized the soldering of insulator so as to resolve the existing defects of traditional insulator soldering such as solder overflow, high void ratio, shortcut and channel blocking. The quantized insulator sealed soldering technology ensured the reliability, air impermeability, uniformity and beautifulness of soldering meanwhile improved operators' efficiency.
Keywordmicrowave module quatization soldering solid solder ring
DOI10.1002/mop.31680
Indexed BySCI
Language英语
WOS Research AreaEngineering ; Optics
WOS SubjectEngineering, Electrical & Electronic ; Optics
WOS IDWOS:000460571000023
PublisherWILEY
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/132196
Collection中国科学院金属研究所
Corresponding AuthorTian, Fei-Fei
Affiliation1.Nanjing Elect Devices Inst, Nanjing 210016, Jiangsu, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China
Recommended Citation
GB/T 7714
Tian, Fei-Fei,Zhou, Ming,Zhang, Jun Zhi. A new quantizing insulator soldering technology scheme for microwave module[J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,2019,61(4):979-984.
APA Tian, Fei-Fei,Zhou, Ming,&Zhang, Jun Zhi.(2019).A new quantizing insulator soldering technology scheme for microwave module.MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,61(4),979-984.
MLA Tian, Fei-Fei,et al."A new quantizing insulator soldering technology scheme for microwave module".MICROWAVE AND OPTICAL TECHNOLOGY LETTERS 61.4(2019):979-984.
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