| Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel | |
| Xi, Tong; Yin, Lu; Yang, Chun-Guang; Yang, Ke | |
| Corresponding Author | Yang, Chun-Guang(cgyang@imr.ac.cn) ; Yang, Ke(kyang@imr.ac.cn) |
| 2019-12-01 | |
| Source Publication | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| ISSN | 1006-7191 |
| Volume | 32Issue:12Pages:1537-1548 |
| Abstract | The hot deformation behavior and processing map of Cu-bearing 2205 duplex stainless steel (2205-Cu DSS) were investigated at temperatures of 950-1150 degrees C and strain rates of 0.01-10 s(-1). The effects of Cu addition and different deformation parameters on deformation behavior were, respectively, characterized by analyzing flow curves, constitutive equations and microstructures. The results indicated that the shapes of flow curves strongly depended on the volume fraction of two phases. When deformed at low strain rate, DRV in ferrite was prompted with increase in the temperature and was further developed to continuous DRX. At high strain rate, flow localization preferentially occurred in ferrite at low deformation temperature due to the strain partitioning and relatively less fraction of ferrite. The activation energy for 2205-Cu DSS was 452 kJ/mol and was found to connect with the variation of strain, strain rate and deformation temperature. The optimum hot deformation parameters for 2205-Cu DSS were obtained in the temperature range of 1100-1150 degrees C and strain rate range of 0.1-1 s(-1) with a peak power dissipation efficiency of 41%. Flow localization was the main way to lead to flow instability. Meanwhile, the Cu-rich precipitates were generated within a few ferrite grains when deformed at temperature lower than 1000 degrees C. The interaction between dislocations and Cu-rich precipitates at high strain rate, as well as the limited DRV in ferrite and DRX in austenite, contributed to the complex microstructure and flow behavior. |
| Keyword | Cu-bearing duplex stainless steel Hot deformation Processing map Dynamic recrystallization Dynamic recovery |
| Funding Organization | National Key Research and Development Program of China ; National Natural Science Foundation of China ; State Key Program of National Natural Science of China ; Shenzhen-Hong Kong Technology Cooperation Funding Scheme ; Shenzhen Science and Technology Research Funding |
| DOI | 10.1007/s40195-019-00910-6 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key Research and Development Program of China[2016YFB0300205] ; National Natural Science Foundation of China[51501188] ; National Natural Science Foundation of China[51771199] ; State Key Program of National Natural Science of China[51631009] ; Shenzhen-Hong Kong Technology Cooperation Funding Scheme[SGLH20150213143207910] ; Shenzhen Science and Technology Research Funding[JCYJ20160608153641020] |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000495116000011 |
| Publisher | CHINESE ACAD SCIENCES, INST METAL RESEARCH |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/136837 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Yang, Chun-Guang; Yang, Ke |
| Affiliation | Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China |
| Recommended Citation GB/T 7714 | Xi, Tong,Yin, Lu,Yang, Chun-Guang,et al. Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2019,32(12):1537-1548. |
| APA | Xi, Tong,Yin, Lu,Yang, Chun-Guang,&Yang, Ke.(2019).Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel.ACTA METALLURGICA SINICA-ENGLISH LETTERS,32(12),1537-1548. |
| MLA | Xi, Tong,et al."Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel".ACTA METALLURGICA SINICA-ENGLISH LETTERS 32.12(2019):1537-1548. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment