Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process

doi:10.1007/s12540-019-00333-z

IMR OpenIR

	Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
	Hua, Fu-an 1; Song, Hong-wu 2; Sun, Tao 1; Li, Jian-ping 1
通讯作者	Song, Hong-wu(hwsong@imr.ac.cn)
	2020-03-01
发表期刊	METALS AND MATERIALS INTERNATIONAL
ISSN	1598-9623
卷号	26 期号:3 页码:333-345
摘要	A model based on inter-diffusion theory was established to predict growth kinetics of the intermetallic compounds (IMCs) formed in roll bonded Al/Cu sheets during annealing process. The model can give good prediction of both IMC layers growth kinetics and element concentration distribution at the interface of roll bonded Cu/Al sheets with different thickness under different annealing conditions with certain roll reduction range. It is revealed that the calculated results of the proposed model are depended on the inter-diffusion coefficient of each components, which could be related to the interface bonding state, i.e., bonding methods or rolling reductions for roll bonding. And there was big difference in inter-diffusion coefficient of Al and Cu matrix under different bonding state, while the inter-diffusion coefficient of IMCs changed slightly. Graphic
关键词	Bimetal Cold roll bonding Intermetallic compound Growth kinetics Inter-diffusion
DOI	10.1007/s12540-019-00333-z
收录类别	SCI
语种	英语
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000517098900007
出版者	KOREAN INST METALS MATERIALS
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/137365
专题	中国科学院金属研究所
通讯作者	Song, Hong-wu
作者单位	1.Northeastern Univ, State Key Lab Rolling & Automat, Shenyang 110819, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Hua, Fu-an,Song, Hong-wu,Sun, Tao,et al. Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process[J]. METALS AND MATERIALS INTERNATIONAL,2020,26(3):333-345.
APA	Hua, Fu-an,Song, Hong-wu,Sun, Tao,&Li, Jian-ping.(2020).Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process.METALS AND MATERIALS INTERNATIONAL,26(3),333-345.
MLA	Hua, Fu-an,et al."Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process".METALS AND MATERIALS INTERNATIONAL 26.3(2020):333-345.