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The role of prismatic slip dependent dynamic recrystallization in the fabrication of a submicrocrystalline Ti-Cu alloy with high thermostability
Wang, Hai1; Song, Wei1; Koenigsmann, Konrad2; Zhang, Shuyuan1; Ren, Ling1; Yang, Ke1
Corresponding AuthorRen, Ling(lren@imr.ac.cn)
2020-03-01
Source PublicationMATERIALS & DESIGN
ISSN0264-1275
Volume188Pages:16
AbstractWhen submicrocrystalline metal materials were first made available, their beneficial properties opened up various interesting design applications. However, several shortcomings soon became clear. One large problem is their complicated fabrication process, which cannot be applied on a large-scale industrial level. Another particularly vexing issue is their microstructural instability, which, even at lower temperatures, causes grains to rapidly coarsen. In this study, we have overcome these two problems in a submicrocrystalline Ti-Cu binary alloy. Contrary to conventional ideas of "microstructural heredity," we have found that deformation with an initial coarse lamellar alpha' microstructure when prism slip systems have been activated can remarkably refine grains to the sub-micron scale. We have also developed a strategy to improve the microstructural thermostability through Cu alloying, so that the submicrocrystalline grains formed during deformation at elevated temperatures can successfully be retained to room temperature. This study provides a theoretical foundation for the fabrication of submicrocrystalline titanium alloys using conventional hot rolling technology, which gives this alloy potential for further development within the titanium industry. (C) 2020 The Authors. Published by Elsevier Ltd.
KeywordTitanium alloy Submicrocrystalline Prism slip Thermostability
Funding OrganizationNational Key Research and Development Program of China ; National Natural Science Foundation of China ; Youth Innovation Promotion Association, CAS ; Promoting Liaoning Province Talents Program -Top Young Talents
DOI10.1016/j.matdes.2020.108475
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program of China[2018YFC1106601] ; National Key Research and Development Program of China[2016YFC1100600] ; National Natural Science Foundation of China[51631009] ; Youth Innovation Promotion Association, CAS[2014168] ; Promoting Liaoning Province Talents Program -Top Young Talents[XLYC1807069]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000514567900066
PublisherELSEVIER SCI LTD
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/137777
Collection中国科学院金属研究所
Corresponding AuthorRen, Ling
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
2.Univ Chicago, Chicago, IL 60637 USA
Recommended Citation
GB/T 7714
Wang, Hai,Song, Wei,Koenigsmann, Konrad,et al. The role of prismatic slip dependent dynamic recrystallization in the fabrication of a submicrocrystalline Ti-Cu alloy with high thermostability[J]. MATERIALS & DESIGN,2020,188:16.
APA Wang, Hai,Song, Wei,Koenigsmann, Konrad,Zhang, Shuyuan,Ren, Ling,&Yang, Ke.(2020).The role of prismatic slip dependent dynamic recrystallization in the fabrication of a submicrocrystalline Ti-Cu alloy with high thermostability.MATERIALS & DESIGN,188,16.
MLA Wang, Hai,et al."The role of prismatic slip dependent dynamic recrystallization in the fabrication of a submicrocrystalline Ti-Cu alloy with high thermostability".MATERIALS & DESIGN 188(2020):16.
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