Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes | |
Ren, C. X.1,2; Wang, Q.1; Hou, J. P.1; Zhang, Z. J.1; Yang, H. J.1; Zhang, Z. F.1,2 | |
Corresponding Author | Wang, Q.(gmwang@imr.ac.cn) ; Zhang, Z. F.(zhfzhang@imr.ac.cn) |
2020-03-19 | |
Source Publication | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
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ISSN | 0921-5093 |
Volume | 778Pages:6 |
Abstract | Surface strengthened Cu samples with ultra-fine grain (UFG), fine grain (FG), and coarse grain (CG) matrixes were prepared by cold-rolling, controlled annealing, and then treated by surface spinning strengthening (3S) to reveal the effect of grain size on the feature of the hardened layer. The results indicate that the maximum microhardness of the hardened layer was slightly affected by grain size. The thickness of the hardened layer is significantly influenced by grain size. When decreasing the grain size of matrix from CG to UFG, the thickness of the hardened layer displays an increasing then deceasing trend, and approaches in the highest thickness at FG. |
Keyword | Cu Gradient microstructure Hardened layer Microhardness Grain size |
Funding Organization | National Natural Science Foundation of China (NSFC) ; LiaoNing Revitalization Talents Program |
DOI | 10.1016/j.msea.2020.139113 |
Indexed By | SCI |
Language | 英语 |
Funding Project | National Natural Science Foundation of China (NSFC)[U1664253] ; National Natural Science Foundation of China (NSFC)[51331007] ; LiaoNing Revitalization Talents Program[XLYC1808027] |
WOS Research Area | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
WOS Subject | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000524352200016 |
Publisher | ELSEVIER SCIENCE SA |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/138163 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Wang, Q.; Zhang, Z. F. |
Affiliation | 1.Chinese Acad Sci, Inst Met Res, Lab Fatigue & Fracture Mat, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Peoples R China |
Recommended Citation GB/T 7714 | Ren, C. X.,Wang, Q.,Hou, J. P.,et al. Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,778:6. |
APA | Ren, C. X.,Wang, Q.,Hou, J. P.,Zhang, Z. J.,Yang, H. J.,&Zhang, Z. F..(2020).Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,778,6. |
MLA | Ren, C. X.,et al."Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 778(2020):6. |
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