IMR OpenIR
Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes
Ren, C. X.1,2; Wang, Q.1; Hou, J. P.1; Zhang, Z. J.1; Yang, H. J.1; Zhang, Z. F.1,2
通讯作者Wang, Q.(gmwang@imr.ac.cn) ; Zhang, Z. F.(zhfzhang@imr.ac.cn)
2020-03-19
发表期刊MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
卷号778页码:6
摘要Surface strengthened Cu samples with ultra-fine grain (UFG), fine grain (FG), and coarse grain (CG) matrixes were prepared by cold-rolling, controlled annealing, and then treated by surface spinning strengthening (3S) to reveal the effect of grain size on the feature of the hardened layer. The results indicate that the maximum microhardness of the hardened layer was slightly affected by grain size. The thickness of the hardened layer is significantly influenced by grain size. When decreasing the grain size of matrix from CG to UFG, the thickness of the hardened layer displays an increasing then deceasing trend, and approaches in the highest thickness at FG.
关键词Cu Gradient microstructure Hardened layer Microhardness Grain size
资助者National Natural Science Foundation of China (NSFC) ; LiaoNing Revitalization Talents Program
DOI10.1016/j.msea.2020.139113
收录类别SCI
语种英语
资助项目National Natural Science Foundation of China (NSFC)[U1664253] ; National Natural Science Foundation of China (NSFC)[51331007] ; LiaoNing Revitalization Talents Program[XLYC1808027]
WOS研究方向Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000524352200016
出版者ELSEVIER SCIENCE SA
引用统计
被引频次:11[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/138163
专题中国科学院金属研究所
通讯作者Wang, Q.; Zhang, Z. F.
作者单位1.Chinese Acad Sci, Inst Met Res, Lab Fatigue & Fracture Mat, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Peoples R China
推荐引用方式
GB/T 7714
Ren, C. X.,Wang, Q.,Hou, J. P.,et al. Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,778:6.
APA Ren, C. X.,Wang, Q.,Hou, J. P.,Zhang, Z. J.,Yang, H. J.,&Zhang, Z. F..(2020).Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,778,6.
MLA Ren, C. X.,et al."Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 778(2020):6.
条目包含的文件
条目无相关文件。
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[Ren, C. X.]的文章
[Wang, Q.]的文章
[Hou, J. P.]的文章
百度学术
百度学术中相似的文章
[Ren, C. X.]的文章
[Wang, Q.]的文章
[Hou, J. P.]的文章
必应学术
必应学术中相似的文章
[Ren, C. X.]的文章
[Wang, Q.]的文章
[Hou, J. P.]的文章
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。