Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding

doi:10.1016/j.jmst.2019.11.015

IMR OpenIR

	Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding
	Zhang, Jian Yang 1,2,3; Xu, Bin 1,3; Tariq, Naeemul Haq 4; Sun, MingYue 1,3; Li, DianZhong 3; Li, Yi Yi 1
通讯作者	Sun, MingYue(mysun@imr.ac.cn)
	2020-06-01
发表期刊	JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN	1005-0302
卷号	46 页码:1-11
摘要	As an advanced solid state bonding process, plastic deformation bonding (PDB) is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling. In this study, PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions. It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization (DDRX) at 1000-1150 degrees C. Electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) results revealed that the bonding of joints is related with interfacial grain boundary (IGB) bulging process, which is considered as a nucleation process of DRXed grain under different deformation environments. During recrystallization process, the bonded interface moved due to strain-induced boundary migration (SIBM) process. Stored energy difference (caused by accumulation of dislocations at the bonding interface) was the dominant factor for SIBM during DRX. The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
关键词	Isothermal compression bonding Dynamic recrystallization Microstructures Grain boundary Misorientation
资助者	National Key Research and Development Program ; National Natural Science Foundation of China ; National Science and Technology Major Project of China ; Key Program of the Chinese Academy of Sciences ; CAS Interdisciplinary Innovation Team
DOI	10.1016/j.jmst.2019.11.015
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Program[2018YFA0702900] ; National Natural Science Foundation of China[U1508215] ; National Natural Science Foundation of China[51774265] ; National Science and Technology Major Project of China[2019ZX06004010] ; Key Program of the Chinese Academy of Sciences[ZDRW-CN-2017-1] ; CAS Interdisciplinary Innovation Team
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000525326000001
出版者	JOURNAL MATER SCI TECHNOL
引用统计	被引频次：69[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/138203
专题	中国科学院金属研究所
通讯作者	Sun, MingYue
作者单位	1.Chinese Acad Sci, Inst Met Res, Key Lab Nucl Mat & Safety Assessment, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 4.Pakistan Inst Engn & Appl Sci, Dept Met & Mat Engn, Islamabad, Pakistan
推荐引用方式 GB/T 7714	Zhang, Jian Yang,Xu, Bin,Tariq, Naeemul Haq,et al. Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,46:1-11.
APA	Zhang, Jian Yang,Xu, Bin,Tariq, Naeemul Haq,Sun, MingYue,Li, DianZhong,&Li, Yi Yi.(2020).Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,46,1-11.
MLA	Zhang, Jian Yang,et al."Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 46(2020):1-11.