| Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding | |
| Zhang, Jian Yang1,2,3; Xu, Bin1,3; Tariq, Naeemul Haq4; Sun, MingYue1,3; Li, DianZhong3; Li, Yi Yi1 | |
| Corresponding Author | Sun, MingYue(mysun@imr.ac.cn) |
| 2020-06-01 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| ISSN | 1005-0302 |
| Volume | 46Pages:1-11 |
| Abstract | As an advanced solid state bonding process, plastic deformation bonding (PDB) is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling. In this study, PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions. It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization (DDRX) at 1000-1150 degrees C. Electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) results revealed that the bonding of joints is related with interfacial grain boundary (IGB) bulging process, which is considered as a nucleation process of DRXed grain under different deformation environments. During recrystallization process, the bonded interface moved due to strain-induced boundary migration (SIBM) process. Stored energy difference (caused by accumulation of dislocations at the bonding interface) was the dominant factor for SIBM during DRX. The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
| Keyword | Isothermal compression bonding Dynamic recrystallization Microstructures Grain boundary Misorientation |
| Funding Organization | National Key Research and Development Program ; National Natural Science Foundation of China ; National Science and Technology Major Project of China ; Key Program of the Chinese Academy of Sciences ; CAS Interdisciplinary Innovation Team |
| DOI | 10.1016/j.jmst.2019.11.015 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key Research and Development Program[2018YFA0702900] ; National Natural Science Foundation of China[U1508215] ; National Natural Science Foundation of China[51774265] ; National Science and Technology Major Project of China[2019ZX06004010] ; Key Program of the Chinese Academy of Sciences[ZDRW-CN-2017-1] ; CAS Interdisciplinary Innovation Team |
| WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000525326000001 |
| Publisher | JOURNAL MATER SCI TECHNOL |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/138203 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Sun, MingYue |
| Affiliation | 1.Chinese Acad Sci, Inst Met Res, Key Lab Nucl Mat & Safety Assessment, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 4.Pakistan Inst Engn & Appl Sci, Dept Met & Mat Engn, Islamabad, Pakistan |
| Recommended Citation GB/T 7714 | Zhang, Jian Yang,Xu, Bin,Tariq, Naeemul Haq,et al. Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,46:1-11. |
| APA | Zhang, Jian Yang,Xu, Bin,Tariq, Naeemul Haq,Sun, MingYue,Li, DianZhong,&Li, Yi Yi.(2020).Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,46,1-11. |
| MLA | Zhang, Jian Yang,et al."Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 46(2020):1-11. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment