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Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding
Zhang, Jian Yang1,2,3; Xu, Bin1,3; Tariq, Naeemul Haq4; Sun, MingYue1,3; Li, DianZhong3; Li, Yi Yi1
Corresponding AuthorSun, MingYue(mysun@imr.ac.cn)
2020-06-01
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume46Pages:1-11
AbstractAs an advanced solid state bonding process, plastic deformation bonding (PDB) is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling. In this study, PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions. It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization (DDRX) at 1000-1150 degrees C. Electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) results revealed that the bonding of joints is related with interfacial grain boundary (IGB) bulging process, which is considered as a nucleation process of DRXed grain under different deformation environments. During recrystallization process, the bonded interface moved due to strain-induced boundary migration (SIBM) process. Stored energy difference (caused by accumulation of dislocations at the bonding interface) was the dominant factor for SIBM during DRX. The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
KeywordIsothermal compression bonding Dynamic recrystallization Microstructures Grain boundary Misorientation
Funding OrganizationNational Key Research and Development Program ; National Natural Science Foundation of China ; National Science and Technology Major Project of China ; Key Program of the Chinese Academy of Sciences ; CAS Interdisciplinary Innovation Team
DOI10.1016/j.jmst.2019.11.015
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program[2018YFA0702900] ; National Natural Science Foundation of China[U1508215] ; National Natural Science Foundation of China[51774265] ; National Science and Technology Major Project of China[2019ZX06004010] ; Key Program of the Chinese Academy of Sciences[ZDRW-CN-2017-1] ; CAS Interdisciplinary Innovation Team
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000525326000001
PublisherJOURNAL MATER SCI TECHNOL
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/138203
Collection中国科学院金属研究所
Corresponding AuthorSun, MingYue
Affiliation1.Chinese Acad Sci, Inst Met Res, Key Lab Nucl Mat & Safety Assessment, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
4.Pakistan Inst Engn & Appl Sci, Dept Met & Mat Engn, Islamabad, Pakistan
Recommended Citation
GB/T 7714
Zhang, Jian Yang,Xu, Bin,Tariq, Naeemul Haq,et al. Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,46:1-11.
APA Zhang, Jian Yang,Xu, Bin,Tariq, Naeemul Haq,Sun, MingYue,Li, DianZhong,&Li, Yi Yi.(2020).Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,46,1-11.
MLA Zhang, Jian Yang,et al."Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 46(2020):1-11.
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