| Rapid heating induced ultrahigh stability of nanograined copper | |
| Li, X. Y.; Zhou, X.; Lu, K. | |
| Corresponding Author | Li, X. Y.(xyli@imr.ac.cn) ; Lu, K.(lu@imr.ac.cn) |
| 2020-04-01 | |
| Source Publication | SCIENCE ADVANCES
 |
| ISSN | 2375-2548 |
| Volume | 6Issue:17Pages:6 |
| Abstract | Inherent thermal and mechanical instability of nanograined materials bottlenecks their processing and technological applications. In addition to the traditional stabilization strategy, which is based on alloying, grain boundary relaxation was recently found to be effective in stabilizing nanograined pure metals. Grain boundary relaxation can be induced by deforming very fine nanograins below a critical size, typically several tens of nanometers. Here, we found that rapid heating may trigger intensive boundary relaxation of pure Cu nanograins with sizes up to submicrometers, a length scale with notable instability in metals. The rapidly heated Cu nanograins remain stable at temperatures as high as 0.6 T-m (melting point), even higher than the recrystallization temperature of deformed coarse-grained Cu. The thermally induced grain boundary relaxation originating from the generation of high-density nanotwins offers a alternative approach to stabilizing nanostructured materials. |
| Funding Organization | Ministry of Science and Technology of China ; National Science Foundation of China ; Chinese Academy of Sciences |
| DOI | 10.1126/sciadv.aaz8003 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | Ministry of Science and Technology of China[2017YFA0204401] ; Ministry of Science and Technology of China[2017YFA0700700] ; National Science Foundation of China[51231006] ; Chinese Academy of Sciences[zdyz201701] |
| WOS Research Area | Science & Technology - Other Topics |
| WOS Subject | Multidisciplinary Sciences |
| WOS ID | WOS:000530628100037 |
| Publisher | AMER ASSOC ADVANCEMENT SCIENCE |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/138811 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Li, X. Y.; Lu, K. |
| Affiliation | Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China |
| Recommended Citation GB/T 7714 | Li, X. Y.,Zhou, X.,Lu, K.. Rapid heating induced ultrahigh stability of nanograined copper[J]. SCIENCE ADVANCES,2020,6(17):6. |
| APA | Li, X. Y.,Zhou, X.,&Lu, K..(2020).Rapid heating induced ultrahigh stability of nanograined copper.SCIENCE ADVANCES,6(17),6. |
| MLA | Li, X. Y.,et al."Rapid heating induced ultrahigh stability of nanograined copper".SCIENCE ADVANCES 6.17(2020):6. |
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