Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics

doi:10.1016/j.msea.2020.139786

IMR OpenIR

	Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics
	Yang, Yu-Jia 1; Zhang, Bin 1; Wan, Hong-Yuan 2,3; Zhang, Guang-Ping 2
通讯作者	Zhang, Bin(zhangb@atm.neu.edu.cn) ; Zhang, Guang-Ping(gpzhang@imr.ac.cn)
	2020-08-05
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	792 页码:10
摘要	To enhance the mechanical reliability without sacrificing the electrical conductivity of the flexible electronics, in this work submicmn-thick Cu/Au/PI (CAP) and graphene/Cu/Au/PI (GCAP) films were fabricated successfully by using a series of assembly methods through introducing a graphene passivation layer onto the polyimide (PI)-supported Cu film surface, and a nanoscale gold (Au) interlayer between the Cu/PI interface. Tensile testing results reveal that the yield strength, the fracture strain and the electrical properties of the GCAP film were improved simultaneously. Furthermore, the GCAP film also exhibited a higher fatigue strength than the CAP film. The basic mechanism is mainly attributed to the effective suppression of the Cu/graphene interface on the fatigue extrusion formation through constraining dislocation motion.
关键词	Cu Graphene Interface Fatigue extrusions Voids
资助者	National Natural Science Foundation of China (NSFC)
DOI	10.1016/j.msea.2020.139786
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China (NSFC)[51671050] ; National Natural Science Foundation of China (NSFC)[51971060]
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000553980500026
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：8[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/140021
专题	中国科学院金属研究所
通讯作者	Zhang, Bin; Zhang, Guang-Ping
作者单位	1.Northeastern Univ, Sch Mat Sci & Engn, Key Lab Anisotropy & Texture Mat, Minist Educ, 3-11 Wenhua Rd, Shenyang 110819, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, 72 Wenhua Rd, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,et al. Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,792:10.
APA	Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,&Zhang, Guang-Ping.(2020).Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,792,10.
MLA	Yang, Yu-Jia,et al."Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 792(2020):10.