Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions

doi:10.1007/s12598-020-01599-8

IMR OpenIR

	Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions
	Geng, Peng-Fei 1,2; Zhao, Jin-Long 2; Xi, Tong 2; Yang, Chun-Guang 2; Yang, Ke 2
通讯作者	Yang, Chun-Guang(cgyang@imr.ac.cn)
	2020-10-16
发表期刊	RARE METALS
ISSN	1001-0521
页码	8
摘要	In this work, the stability of passive film for long-time immersed Cu-bearing L605 (L605-Cu) alloy in the phosphate buffer solution (PBS) was studied by potentiodynamic polarization and electrochemical impedance spectroscopy. The results showed that the impedance of passive film for L605-Cu alloy experienced an initial increase and subsequent stabilization with the increase in the immersion time. In addition, the plate count method was employed to assess the antibacterial durability of L605-Cu alloy againstEscherichia coliafter long-time immersion. The results indicated that the antibacterial rate of L605-Cu alloy presented a declining tendency with the immersion time prolonging. X-ray photoelectron spectroscopy (XPS) was used to analyze the change of the chemical composition in the passive film on L605-Cu alloy immersed in the PBS for different time. The results showed that Cu content and its compounds in the passive film gradually increased with the immersion time prolonging, hinting declined activity of Cu ions penetrating into the passive film, which resulted in a decrease in the antibacterial performance.
关键词	L605-Cu alloy Passive film Antibacterial rate Implant
资助者	National Natural Science Foundation of China ; National Key Research and Development Program
DOI	10.1007/s12598-020-01599-8
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[51771199] ; National Natural Science Foundation of China[51631009] ; National Natural Science Foundation of China[51501188] ; National Key Research and Development Program[2016YFB0300205]
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000577854600001
出版者	NONFERROUS METALS SOC CHINA
引用统计	被引频次：5[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/140933
专题	中国科学院金属研究所
通讯作者	Yang, Chun-Guang
作者单位	1.Univ Sci & Technol China, Sch Nano Sci & Technol Inst, Suzhou 215300, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Geng, Peng-Fei,Zhao, Jin-Long,Xi, Tong,et al. Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions[J]. RARE METALS,2020:8.
APA	Geng, Peng-Fei,Zhao, Jin-Long,Xi, Tong,Yang, Chun-Guang,&Yang, Ke.(2020).Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions.RARE METALS,8.
MLA	Geng, Peng-Fei,et al."Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions".RARE METALS (2020):8.