| Heat transfer and grain refining mechanism during melt treatment by cooling sloping plate | |
| Alternative Title | Heat transfer and grain refining mechanism during melt treatment by cooling sloping plate |
| Guan Renguo; Zhao Zhanyong; Chao Runze; Huang Hongqian; Liu Chunming | |
| 2012 | |
| Source Publication | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| ISSN | 1006-7191 |
| Volume | 25Issue:4Pages:320-328 |
| Abstract | Heat transfer of flow melt and grain refining mechanism during melt treatment by the cooling sloping plate were investigated. The results show that the cooling sloping plate can refine riot only grains of alloys but also can obviously refine pure metal. Cooling ability of the plate is the key factor that induces grain refining, the plate material and the flow amount can affect cooling rate of the melt and thus affect refining effectiveness. The cooling rate of the melt on the cooling sloping plate is much faster than that of the conventional casting process, which can reach 1000 K/s and belongs to meta-rapid solidification scope. The thickness of the temperature boundary layer is much larger than that of the velocity boundary layer on the sloping plate, but the temperature gradient is small in the temperature boundary layer. Under strong cooling action by the cooling plate, most parts of the melt on the plate surface can form undercooling, which causes continuous eruptive nucleation, this is the main grain refining mechanism, and the heterogeneous nucleation on the plate surface is a helpful supplement for the nucleation. |
| Other Abstract | Heat transfer of flow melt and grain refining mechanism during melt treatment by the cooling sloping plate were investigated.The results show that the cooling sloping plate can refine not only grains of alloys but also can obviously refine pure metal.Cooling ability of the plate is the key factor that induces grain refining,the plate material and the flow amount can affect cooling rate of the melt and thus affect refining effectiveness.The cooling rate of the melt on the cooling sloping plate is much faster than that of the conventional casting process,which can reach 1000 K/s and belongs to meta-rapid solidification scope.The thickness of the temperature boundary layer is much larger than that of the velocity boundary layer on the sloping plate,but the temperature gradient is small in the temperature boundary layer.Under strong cooling action by the cooling plate,most parts of the melt on the plate surface can form undercooling,which causes continuous eruptive nucleation,this is the main grain refining mechanism,and the heterogeneous nucleation on the plate surface is a helpful supplement for the nucleation. |
| Keyword | ALUMINUM-ALLOY MICROSTRUCTURE EVOLUTION STATE Grain refining Nucleation Cooling rate Sloping plate Temperature boundary layer |
| Indexed By | CSCD |
| Language | 英语 |
| Funding Project | [National Natural Science Foundation of China] ; [Fok Ying Tong Education Foundation] ; [National Basic Research Program of China (973 program)] |
| CSCD ID | CSCD:4621353 |
| Citation statistics |
Cited Times:2[CSCD]
[CSCD Record]
|
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/144991 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | Guan Renguo,Zhao Zhanyong,Chao Runze,et al. Heat transfer and grain refining mechanism during melt treatment by cooling sloping plate[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2012,25(4):320-328. |
| APA | Guan Renguo,Zhao Zhanyong,Chao Runze,Huang Hongqian,&Liu Chunming.(2012).Heat transfer and grain refining mechanism during melt treatment by cooling sloping plate.ACTA METALLURGICA SINICA-ENGLISH LETTERS,25(4),320-328. |
| MLA | Guan Renguo,et al."Heat transfer and grain refining mechanism during melt treatment by cooling sloping plate".ACTA METALLURGICA SINICA-ENGLISH LETTERS 25.4(2012):320-328. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment