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Thermal stability of electrodeposited nanocrystalline nickel assisted by flexible friction
Alternative TitleThermal stability of electrodeposited nanocrystalline nickel assisted by flexible friction
Lue Biao1; Hu Zhenfeng3; Wang Xiaohe2; Xu Binshi2
2015
Source PublicationTRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
ISSN1003-6326
Volume25Issue:10Pages:3297-3304
AbstractNanocrystalline nickel coating was prepared by flexible friction assisted electrodeposition technology in an additive-free Watts bath. The coating consists of massive equiaxial crystals with an average grain size of about 24 nm and exhibits a (111) preferred orientation. The differential scanning calorimetry (DSC) analysis of nanocrystalline nickel demonstrates that the peak temperature of rapid grain growth is about 285.4 degrees C, and the peak temperature of grain growth towards equilibrium is around 431.5 degrees C. The isochronous annealing results reveal that abnormal grain growth behavior is not observed in nanocrystalline nickel without sulfur-containing. The thermal stability of the deposition was improved due to its initial microstructure of the as-deposited nickel and a certain amount of annealing nano-twins with low-energy, which reduces the driving force for grain growth. Consequently, the coating shows a low residual tensile stress of about 50 MPa and a high microhardness of HV 400 at the annealing temperature of 450 degrees C.
Other AbstractNanocrystalline nickel coating was prepared by flexible friction assisted electrodeposition technology in an additive-free Watts bath. The coating consists of massive equiaxial crystals with an average grain size of about 24 nm and exhibits a (111) preferred orientation. The differential scanning calorimetry (DSC) analysis of nanocrystalline nickel demonstrates that the peak temperature of rapid grain growth is about 285.4 °C, and the peak temperature of grain growth towards equilibrium is around 431.5 °C. The isochronous annealing results reveal that abnormal grain growth behavior is not observed in nanocrystalline nickel without sulfur-containing. The thermal stability of the deposition was improved due to its initial microstructure of the as-deposited nickel and a certain amount of annealing nano-twins with low-energy, which reduces the driving force for grain growth. Consequently, the coating shows a low residual tensile stress of about 50 MPa and a high microhardness of HV 400 at the annealing temperature of 450 °C.
KeywordGRAIN-GROWTH BEHAVIOR electrodeposition nanocrystalline nickel flexible friction thermal stability grain growth
Indexed ByCSCD
Language英语
Funding Project[National Natural Science Foundation of China] ; [Basic Research Development Program of China]
CSCD IDCSCD:5569248
Citation statistics
Cited Times:1[CSCD]   [CSCD Record]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/149252
Collection中国科学院金属研究所
Affiliation1.中国科学院金属研究所
2.Acad Armored Forces Engn, Natl Key Lab Remfg, Beijing 100072, Peoples R China
3.Acad Armored Forces Engn, Natl Engn Res Ctr Mech Prod Remfg, Beijing 100072, Peoples R China
Recommended Citation
GB/T 7714
Lue Biao,Hu Zhenfeng,Wang Xiaohe,et al. Thermal stability of electrodeposited nanocrystalline nickel assisted by flexible friction[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,2015,25(10):3297-3304.
APA Lue Biao,Hu Zhenfeng,Wang Xiaohe,&Xu Binshi.(2015).Thermal stability of electrodeposited nanocrystalline nickel assisted by flexible friction.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,25(10),3297-3304.
MLA Lue Biao,et al."Thermal stability of electrodeposited nanocrystalline nickel assisted by flexible friction".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 25.10(2015):3297-3304.
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