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高孔率网状Cu+CeO2/Cu抗菌材料的制备及其抗菌性能
Alternative TitlePreparation and antibacterial properties of Cu+CeO2/Cu porous materials
于志明; 王智学; 韩恩厚
2009
Source Publication功能材料
ISSN1001-9731
Volume40.0Issue:002Pages:265-267
Abstract以泡沫海绵为基体材料,通过电镀的方法制备了高孔率网状Cu+CeO2/Cu抗菌材料,研究了制备条件并测定了其孔隙率和比表面积,评价了其抗菌性能。结果表明,网状Cu+CeO2/Cu抗菌材料的孔隙率高达95%以上,其比表面积约为31.4m^2/cm^3,对于大肠埃希氏菌、金黄色葡萄球菌和白色念珠菌3种菌种均具有良好的抗菌性能。
Other AbstractThe porous materials of Cu+CeO2/Cu were prepared by the electro-deposition on a precursor of con- ventional polyamide foam. Their porosity and specific surface area were measured. Antibacterial properties of Cu+CeO2/Cu porous materials were investigated. The results show that their porosity may reach above 95% and specific surface area is about 31.4m^2/cm^3. The porous materials of Cu+CeO2/Cu exhibited excellent antibacterial properties against E. coli, S. aureus and C. albicans.
Keyword高孔率 网状Cu+CeO2/Cu 抗菌性能
Indexed ByCSCD
Language中文
CSCD IDCSCD:3586935
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/149264
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
于志明,王智学,韩恩厚. 高孔率网状Cu+CeO2/Cu抗菌材料的制备及其抗菌性能[J]. 功能材料,2009,40.0(002):265-267.
APA 于志明,王智学,&韩恩厚.(2009).高孔率网状Cu+CeO2/Cu抗菌材料的制备及其抗菌性能.功能材料,40.0(002),265-267.
MLA 于志明,et al."高孔率网状Cu+CeO2/Cu抗菌材料的制备及其抗菌性能".功能材料 40.0.002(2009):265-267.
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