| 高孔率网状Cu＋CeO2／Cu抗菌材料的制备及其抗菌性能 | |
| Alternative Title | Preparation and antibacterial properties of Cu＋CeO2/Cu porous materials |
| 于志明; 王智学; 韩恩厚 | |
| 2009 | |
| Source Publication | 功能材料
 |
| ISSN | 1001-9731 |
| Volume | 40.0Issue:002Pages:265-267 |
| Abstract | 以泡沫海绵为基体材料，通过电镀的方法制备了高孔率网状Cu＋CeO2/Cu抗菌材料，研究了制备条件并测定了其孔隙率和比表面积，评价了其抗菌性能。结果表明，网状Cu＋CeO2/Cu抗菌材料的孔隙率高达95％以上，其比表面积约为31．4m^2／cm^3，对于大肠埃希氏菌、金黄色葡萄球菌和白色念珠菌3种菌种均具有良好的抗菌性能。 |
| Other Abstract | The porous materials of Cu＋CeO2/Cu were prepared by the electro-deposition on a precursor of con- ventional polyamide foam. Their porosity and specific surface area were measured. Antibacterial properties of Cu＋CeO2/Cu porous materials were investigated. The results show that their porosity may reach above 95% and specific surface area is about 31.4m^2/cm^3. The porous materials of Cu＋CeO2/Cu exhibited excellent antibacterial properties against E. coli, S. aureus and C. albicans. |
| Keyword | 高孔率 网状Cu＋CeO2／Cu 抗菌性能 |
| Indexed By | CSCD |
| Language | 中文 |
| CSCD ID | CSCD:3586935 |
| Citation statistics |
Cited Times:1[CSCD]
[CSCD Record]
|
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/149264 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | 于志明,王智学,韩恩厚. 高孔率网状Cu＋CeO2／Cu抗菌材料的制备及其抗菌性能[J]. 功能材料,2009,40.0(002):265-267. |
| APA | 于志明,王智学,&韩恩厚.(2009).高孔率网状Cu＋CeO2／Cu抗菌材料的制备及其抗菌性能.功能材料,40.0(002),265-267. |
| MLA | 于志明,et al."高孔率网状Cu＋CeO2／Cu抗菌材料的制备及其抗菌性能".功能材料 40.0.002(2009):265-267. |
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