| Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate | |
| Sun FuLong1; Gao LiYin1; Liu ZhiQuan1; Zhang Hao3; Sugahara Tohru3; Nagao Shijo3; Suganuma Katsuaki3 | |
| 2018 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| ISSN | 1005-0302 |
| Volume | 34Issue:10Pages:1885-1890 |
| Abstract | Homogeneous columnar Cu film with fully embedded nanotwins was successfully fabricated on Ti/Cu seed layer on silicon wafer. The nanotwins with thickness of tens of nanometers are generally parallel to the silicon surface, showing a strong (111) preferred orientation. The acid concentration was found to be important in influencing the formation of nanoscale twins. By adjusting the acid concentration, the nanotwins can be induced from the top columnar grain to middle columnar grain and reach the bottom equiaxed grain, and a microstructural transformation model was given. A theory focusing on the cathode overpotential was proposed to reveal the effect of acid concentration on the growth mechanism of nanoscale twins. An appropriate adsorption proportion of hydrogen on cathode (acid concentration 17 ml L-1) could increase the overpotential which supplies adequate nucleation energy for nanoscale twins formation. (C) 2018 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
| Other Abstract | Homogeneous columnar Cu film with fully embedded nanotwins was successfully fabricated on Ti/Cu seed layer on silicon wafer. The nanotwins with thickness of tens of nanometers are generally parallel to the silicon surface, showing a strong (111) preferred orientation. The acid concentration was found to be important in influencing the formation of nanoscale twins. By adjusting the acid concentration, the nanotwins can be induced from the top columnar grain to middle columnar grain and reach the bottom equiaxed grain, and a microstructural transformation model was given. A theory focusing on the cathode overpotential was proposed to reveal the effect of acid concentration on the growth mechanism of nanoscale twins. An appropriate adsorption proportion of hydrogen on cathode (acid concentration 17 ml L~(-1)) could increase the overpotential which supplies adequate nucleation energy for nanoscale twins formation. |
| Keyword | NI SOLDER JOINTS NANO-SCALE TWINS INTERFACIAL RELIABILITY FE-NI COPPER METALS DEFORMATION STRENGTH DEPENDENCE BOUNDARIES Electrodeposition Nanotwinned Cu Growth mechanism Acid adsorption |
| Indexed By | CSCD |
| Language | 英语 |
| Funding Project | [National Natural Science Foundation of China] ; [Osaka University Visiting Scholar Program] |
| CSCD ID | CSCD:6335120 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/153293 |
| Collection | 中国科学院金属研究所 |
| Affiliation | 1.中国科学院金属研究所 2.中国科学院大学 3.Osaka Univ, Institute Sci & Ind Res, Osaka 5670047, Japan |
| Recommended Citation GB/T 7714 | Sun FuLong,Gao LiYin,Liu ZhiQuan,et al. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2018,34(10):1885-1890. |
| APA | Sun FuLong.,Gao LiYin.,Liu ZhiQuan.,Zhang Hao.,Sugahara Tohru.,...&Suganuma Katsuaki.(2018).Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,34(10),1885-1890. |
| MLA | Sun FuLong,et al."Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 34.10(2018):1885-1890. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment