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有限元模拟TiN膜/碳钢基材体系的摩擦磨损试验
Alternative TitleFinite Element Simulation of Friction and Wear Experiment on TiN Film/Carbon Steel Substrate System
杨洪刚; 李曙; 刘阳; 王鹏
2009
Source Publication摩擦学学报
ISSN1004-0595
Volume000Issue:004Pages:293-298
Abstract对TiN膜/碳钢基材体系摩擦磨损过程的有限元模拟表明:磨痕边缘的多种应力集中、磨痕内外的张应力、膜/基界面切应力,都将影响体系的摩擦学行为.用销/盘试验验证了有限元模拟结果,根据对膜层中裂纹的萌生、扩展和体系的损伤、破坏情况分析,摩擦磨损过程分为磨合、稳定磨损、膜层失稳、体系失效阶段.提出了小载荷摩擦磨损下过软基材的膜/基体系失效机制,即膜层在集中应力和张应力作用下发生裂纹萌生和扩展的脆性破坏,其中,由于体系变形引起的磨痕边缘应力集中对膜层早期损伤进而导致体系磨损失效具有最重要作用.
Other AbstractThe finite element simulation of friction and wear experiment on TiN film/carbon steel substrate system shows that several stress concentrations at edge of grinding- trace, tensile stress inside and outside grindingtrace, shear stress at film/substrate interface all affect tribological behavior of the system. The results calculated by FEM have been confirmed by pin/disc test. According to the analysis of crack initiation and propagation in film as well as damage and breakage of system, the process of friction and wear can be divided into several stages, such as wear - in, steady wear, film unsteady wear, and system failure. The failure mechanism of hard film/soft substrate system in friction and wear experiment under small loading has been suggested. The stress concentrations and tensile stress have important function on crack initiation and propagation, which can cause the brittle breakage in film. The stress concentrations at edge of grinding - trace due to deformation play most important role on early damage which results in wear failure of film/substrate system.
Keyword膜/基体系 摩擦磨损 有限元模拟 应力集中
Indexed ByCSCD
Language中文
CSCD IDCSCD:3669723
Citation statistics
Cited Times:5[CSCD]   [CSCD Record]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/158070
Collection中国科学院金属研究所
Affiliation中国科学院金属研究所
Recommended Citation
GB/T 7714
杨洪刚,李曙,刘阳,等. 有限元模拟TiN膜/碳钢基材体系的摩擦磨损试验[J]. 摩擦学学报,2009,000(004):293-298.
APA 杨洪刚,李曙,刘阳,&王鹏.(2009).有限元模拟TiN膜/碳钢基材体系的摩擦磨损试验.摩擦学学报,000(004),293-298.
MLA 杨洪刚,et al."有限元模拟TiN膜/碳钢基材体系的摩擦磨损试验".摩擦学学报 000.004(2009):293-298.
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