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Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II
Siddiqui, Muhammad Ali1,2,3; Ren, Ling1; Macdonald, Digby D.4; Yang, Ke1
Corresponding AuthorRen, Ling(lren@imr.ac.cnn) ; Macdonald, Digby D.(macdonald@berkeley.edu)
2021-08-01
Source PublicationELECTROCHIMICA ACTA
ISSN0013-4686
Volume386Pages:8
AbstractThe effect of copper content on the passivity of Ti-xCu alloys in a phosphate-buffered saline electrolyte (pH 7.4), in the steady-state condition, was examined using potentiostatic polarization, electrochemical impedance spectroscopy, and Mott-Schottky analysis. The study demonstrates that the oxide layer forms on the Ti-xCu alloys surface have n-type semiconducting character, and the steady-state thickness of the oxide layer is observed linearly and depends on the applied potential. The study observations are in line with the predictions of the Point Defect Model (PDM-II), which provides a physiochemically realistic description of the oxide layer formation on Ti-xCu alloys. The observations reveal that the Cu additions result in a decrease in the charge transfer resistance and capacitances associated with the hydroxide and barrier layer, an increase in the donor density, and reduce the electrochemical resistance of the Ti-xCu alloys. The study also exhibits that the decrease in the steady-state current density after the initial addition of 3 wt% of Cu is attributed to the progressive substitution of copper on the cation sublattice of the film resulting in enhanced electrostatic interaction between the immobilized copper Cu-Ti(x'), and the mobile cation interstitials Cu-i(+) , which carries the excess current over and that conveyed by oxygen vacancies V-o(center dot center dot) in the barrier layer. Moreover, it is also observed that over a hundred-year implant period, about 0.006 cm (0.06 mm) of Ti-3Cu alloy is predicted to lose due to steady-state corrosion in the PBS solution under the given set of conditions, it is further seen that, as the Cu amount increased from 3 wt% to 5 wt% in the Ti-xCu alloys, the steady-state corrosion rate decreases. (C) 2021 Elsevier Ltd. All rights reserved.
KeywordTi-xCu Passivity Electrochemical Impedance Spectroscopy Mott-Schottky Point Defect Model-II
Funding OrganizationNational Natural Science Foundation ; National Key Research and Development Program of China ; Youth Innovation Promotion Association, CAS ; Promoting Liaoning Province Talents Program -Top Young Talents, China ; FUTURE (Fundamental Understanding of Transport Under Reactor Extremes), an Energy Frontier Research Center - U.S. Department of Energy (DOE), Office of Science, Basic Energy Sciences (BES) ; CSC scholarship
DOI10.1016/j.electacta.2021.138466
Indexed BySCI
Languageen
Funding ProjectNational Natural Science Foundation[51631009] ; National Key Research and Development Program of China[2018YFC1106601] ; National Key Research and Development Program of China[2016YFC110 0600] ; Youth Innovation Promotion Association, CAS[2014168] ; Promoting Liaoning Province Talents Program -Top Young Talents, China[XLYC1807069] ; FUTURE (Fundamental Understanding of Transport Under Reactor Extremes), an Energy Frontier Research Center - U.S. Department of Energy (DOE), Office of Science, Basic Energy Sciences (BES) ; CSC scholarship
WOS Research AreaElectrochemistry
WOS SubjectElectrochemistry
WOS IDWOS:000654682900001
PublisherPERGAMON-ELSEVIER SCIENCE LTD
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/160322
Collection中国科学院金属研究所
Corresponding AuthorRen, Ling; Macdonald, Digby D.
Affiliation1.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, 96 Jinzhai Rd, Hefei 230026, Peoples R China
3.NED Univ Engn & Technol, Dept Met Engn, Univ Rd, Karachi 75270, Pakistan
4.Univ Calif Berkeley, Dept Nucl Engn, Berkeley, CA 94720 USA
Recommended Citation
GB/T 7714
Siddiqui, Muhammad Ali,Ren, Ling,Macdonald, Digby D.,et al. Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II[J]. ELECTROCHIMICA ACTA,2021,386:8.
APA Siddiqui, Muhammad Ali,Ren, Ling,Macdonald, Digby D.,&Yang, Ke.(2021).Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II.ELECTROCHIMICA ACTA,386,8.
MLA Siddiqui, Muhammad Ali,et al."Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II".ELECTROCHIMICA ACTA 386(2021):8.
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