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Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates
Kaindl, Reinhard7; Gupta, Tushar1; Bluemel, Alexander2; Pei, Songfeng3; Hou, Peng-Xiang3; Du, Jinhong; Liu, Chang3; Patter, Paul2,7; Popovic, Karl2; Dergez, David4; Elibol, Kenan5; Schaffer, Erhard5; Liu, Johan6; Eder, Dominik1; Kieslinger, Dietmar4; Ren, Wencai3; Hartmann, Paul; Waldhauser, Wolfgang7; Bayer, Bernhard C.1,5
Corresponding AuthorKaindl, Reinhard(reinhard.kaindl@joanneum.at) ; Bayer, Bernhard C.(bernhard.bayer-skoff@tuwien.ac.at)
2021-12-10
Source PublicationACS OMEGA
ISSN2470-1343
Pages13
AbstractDirect-write additive manufacturing of graphene and carbon nanotube (CNT) patterns by aerosol jet printing (AJP) is promising for the creation of thermal and electrical interconnects in (opto)electronics. In realistic application scenarios, this however often requires deposition of graphene and CNT patterns on rugged substrates such as, for example, roughly machined and surface oxidized metal block heat sinks. Most AJP of graphene/CNT patterns has thus far however concentrated on flat wafer-or foil type substrates. Here, we demonstrate AJP of graphene and single walled CNT (SWCNT) patterns on realistically rugged plasma electrolytic-oxidized (PEO) Al blocks, which are promising heat sink materials. We show that AJP on the rugged substrates offers line resolution of down to similar to 40 mu m width for single AJP passes, however, at the cost of noncomplete substrate coverage including noncovered mu m-sized pores in the PEO Al blocks. With multiple AJP passes, full coverage including coverage of the pores is, however, readily achieved. Comparing archetypical aqueous and organic graphene and SWCNT inks, we show that the choice of the ink system drastically influences the nanocarbon AJP parameter window, deposit microstructure including crystalline quality, compactness of deposit, and inter/intrapass layer adhesion for multiple passes. Simple electrical characterization indicates aqueous graphene inks as the most promising choice for AJP-deposited electrical interconnect applications. Our parameter space screening thereby forms a framework for rational process development for graphene and SWCNT AJP on application-relevant, rugged substrates.
Funding OrganizationAustrian Ministry of Transport, Innovation and Technology ; Austrian Research Promotion Agency (FFG) ; Chinese Academy of Sciences ; TU Wien Bibliothek
DOI10.1021/acsomega.1c03871
Indexed BySCI
Language英语
Funding ProjectAustrian Ministry of Transport, Innovation and Technology ; Austrian Research Promotion Agency (FFG)[857181-GRATEC] ; Chinese Academy of Sciences[174321KYSB20160011] ; TU Wien Bibliothek
WOS Research AreaChemistry
WOS SubjectChemistry, Multidisciplinary
WOS IDWOS:000731157400001
PublisherAMER CHEMICAL SOC
Citation statistics
Cited Times:3[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/167269
Collection中国科学院金属研究所
Corresponding AuthorKaindl, Reinhard; Bayer, Bernhard C.
Affiliation1.Tech Univ Wien TU Wien, Inst Mat Chem, A-1060 Vienna, Austria
2.Joanneum Res, Inst Surface Technol & Photon, Mat, A-8160 Weiz, Austria
3.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
4.ZKW Elekt GmbH, A-2700 Neustadt, Austria
5.Univ Vienna, Fac Phys, A-1090 Vienna, Austria
6.Chalmers Univ Technol, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, SE-41296 Gothenburg, Sweden
7.Joanneum Res, Mat Surface Technol & Photon, A-8712 Niklasdorf, Austria
Recommended Citation
GB/T 7714
Kaindl, Reinhard,Gupta, Tushar,Bluemel, Alexander,et al. Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates[J]. ACS OMEGA,2021:13.
APA Kaindl, Reinhard.,Gupta, Tushar.,Bluemel, Alexander.,Pei, Songfeng.,Hou, Peng-Xiang.,...&Bayer, Bernhard C..(2021).Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates.ACS OMEGA,13.
MLA Kaindl, Reinhard,et al."Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates".ACS OMEGA (2021):13.
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