Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires

doi:10.1002/adem.202200037

IMR OpenIR

	Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
	Sun, Pengfei 1,2; Li, Zhiwei 3; Hou, Jiapeng 1; Xu, Aimin 3; Wang, Qiang 1; Zhang, Yi 3; Zhang, Zhenjun 1; Zhang, Penglin 2; Zhang, Zhefeng 1
通讯作者	Hou, Jiapeng(jphou@imr.ac.cn) ; Zhang, Yi(zhfzhang@imr.ac.cn)
	2022-03-27
发表期刊	ADVANCED ENGINEERING MATERIALS
ISSN	1438-1656
页码	13
摘要	In the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen-free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low-temperature region (80-150 degrees C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high-temperature region (above 210 degrees C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations.
关键词	annealing electrical conductivity microstructure evolution oxygen-free copper wire strength
资助者	National Natural Science Foundation of China ; State Grid Corporation of China ; China Postdoctoral Science Foundation
DOI	10.1002/adem.202200037
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[52001313] ; State Grid Corporation of China[5211HD210003] ; China Postdoctoral Science Foundation[2019M661151]
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000773409700001
出版者	WILEY-V C H VERLAG GMBH
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/173039
专题	中国科学院金属研究所
通讯作者	Hou, Jiapeng; Zhang, Yi
作者单位	1.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China 3.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Peoples R China
推荐引用方式 GB/T 7714	Sun, Pengfei,Li, Zhiwei,Hou, Jiapeng,et al. Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires[J]. ADVANCED ENGINEERING MATERIALS,2022:13.
APA	Sun, Pengfei.,Li, Zhiwei.,Hou, Jiapeng.,Xu, Aimin.,Wang, Qiang.,...&Zhang, Zhefeng.(2022).Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires.ADVANCED ENGINEERING MATERIALS,13.
MLA	Sun, Pengfei,et al."Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires".ADVANCED ENGINEERING MATERIALS (2022):13.