Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer

doi:10.1016/j.ceramint.2021.10.234

IMR OpenIR

	Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer
	Cheng, Qiang 1; Zheng, LiLi 2; Li, XiChao 3; Xu, Bin 4,5; Sun, MingYue 4,5; Shi, Jing 1; Dai, ZuoQiang 2; Zhang, TieZhu 2; Zhang, HongXin 2
通讯作者	Zheng, LiLi(llzhengqdu@163.com) ; Xu, Bin(bxu@imr.ac.cn) ; Shi, Jing(shijing@ouc.edu.cn)
	2022-02-15
发表期刊	CERAMICS INTERNATIONAL
ISSN	0272-8842
卷号	48 期号:4 页码:4484-4496
摘要	Ti3SiC2 ceramic and SUS430 stainless steel (SS) were successfully joined by a solid diffusion bonding technique using Ni interlayers. Diffusion bonding was performed in the temperature range of 850 degrees C-1100 degrees C under vacuum. The interfacial reaction phase, morphology evolution, growth kinetics and tensile strength were sys-tematically investigated. In all cases, the inter-diffusion and reaction between Ti3SiC2 and SS can be effectively prevented by Ni foil, and the good transition in the joint benefit to the sound joining. The interface in the joints adjacent to SS matrix was composed of gamma solid solution and a small amount of sigma intermetallic compound. The compounds in the Ni/Ti3SiC2 interface was Ni/Ni(Si)/Ni31Si12 + Ni16Ti6Si7 + Ti3SiC2 + TiCx/Ti2Ni + Ti3SiC2 + TiCx/Ti3SiC2, which formed by the inter-diffusion and chemical reactions between Si and Ni atoms. The diffusion mechanism and reaction mechanism were interrelated, and decided the width of each reaction zones. Further-more, the diffusion activation energy was 113 kJ/mol. The tensile strength increases with increasing the bonding temperature. The minimum and maximum strength of 32.3 MPa and 88.8 MPa were obtained from SUS430/Ni/ Ti3SiC2 joints, which bonding experiments were carried out at 850 degrees C and 1100 degrees C, respectively.
关键词	Solid diffusion bonding Ti3SiC2 ceramic SUS430 Interfacial microstructure Growth kinetics
资助者	National Key Research and Develop-ment Program of China ; National Natural Science Foundation of China ; National Science and Technology Major Project of China ; Natural Science Foundation of Shandong Province
DOI	10.1016/j.ceramint.2021.10.234
收录类别	SCI
语种	英语
资助项目	National Key Research and Develop-ment Program of China[2018YFA0702900] ; National Natural Science Foundation of China[52001179] ; National Natural Science Foundation of China[51774265] ; National Science and Technology Major Project of China[2019ZX06004010] ; Natural Science Foundation of Shandong Province[ZR2020ME019] ; Natural Science Foundation of Shandong Province[ZR201709240128]
WOS研究方向	Materials Science
WOS类目	Materials Science, Ceramics
WOS记录号	WOS:000744048000001
出版者	ELSEVIER SCI LTD
引用统计	被引频次：15[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/173701
专题	中国科学院金属研究所
通讯作者	Zheng, LiLi; Xu, Bin; Shi, Jing
作者单位	1.Ocean Univ China, Sch Mat Sci & Engn, Qingdao 266100, Peoples R China 2.Qingdao Univ, Coll Mech & Elect Engn, Natl Engn Res Ctr Intelligent Elect Vehicle Power, Qingdao 266071, Peoples R China 3.CRRC Qingdao Sifang Rolling Stock Res Inst Co Ltd, Energy Storage Business Dept, Qingdao 266031, Peoples R China 4.Chinese Acad Sci, Inst Met Res, Key Lab Nucl Mat & Safety Assessment, Shenyang 110016, Peoples R China 5.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Cheng, Qiang,Zheng, LiLi,Li, XiChao,et al. Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer[J]. CERAMICS INTERNATIONAL,2022,48(4):4484-4496.
APA	Cheng, Qiang.,Zheng, LiLi.,Li, XiChao.,Xu, Bin.,Sun, MingYue.,...&Zhang, HongXin.(2022).Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer.CERAMICS INTERNATIONAL,48(4),4484-4496.
MLA	Cheng, Qiang,et al."Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer".CERAMICS INTERNATIONAL 48.4(2022):4484-4496.