| The effect of high temperature aging on the corrosion resistance, mechanical property and antibacterial activity of Cu-2205 DSS | |
| Khan, M. Saleem1; Yang, Chunguang2; Pan, Haobo1; Yang, Ke2; Zhao, Ying1 | |
| Corresponding Author | Yang, Ke(Kyang@imr.ac.cn) ; Zhao, Ying(ying.zhao@siat.ac.cn) |
| 2022-03-01 | |
| Source Publication | COLLOIDS AND SURFACES B-BIOINTERFACES
 |
| ISSN | 0927-7765 |
| Volume | 211Pages:9 |
| Abstract | The effects of high temperature aging on the corrosion resistance, mechanical property and antibacterial activity of a copper-bearing 2205 duplex stainless steel (Cu-2205 DSS) were investigated. The results from scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM) and EDS analysis showed that after aging the proportion of gamma phase in microstructure was increased and new sigma phase and copperrich precipitates were formed. The mechanical properties including hardness and tensile and yield strengths of the aged Cu-2205 DSS were significantly enhanced compared to the solution-treated Cu-2205 DSS as well as the 2205 DSS. Electrochemical measurements including electrochemical impedance spectroscopy, potentiodynamic polarization curves and potentiostatic polarization scan were performed to evaluate the corrosion behavior of the Cu-2205 DSS. It was found that aging increased the uniform corrosion resistance but had slightly adverse effect on the pitting corrosion resistance. Additionally, the antibacterial performance of aged Cu-2205 DSS was significantly improved compared to the solution treated Cu-2205 DSS, which was attributed to the more release of copper ions from the matrix that killed the bacteria cells and inhibited the biofilm formation on the surface. The above results suggest that Cu-2205 DSS after high temperature aging revealed good mechanical property, antibacterial performance, and corrosion resistance, which will further expand the application of duplex stainless steel in marine engineering fields. |
| Keyword | Cu-2205 DSS Aging Marine environment Antimicrobial and mechanical properties Corrosion resistance |
| Funding Organization | National Natural Science Foundation of China ; Science and Technology Innovation Commission of Shenzhen |
| DOI | 10.1016/j.colsurfb.2021.112309 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Natural Science Foundation of China[81572113] ; National Natural Science Foundation of China[U1906226] ; National Natural Science Foundation of China[51901242] ; Science and Technology Innovation Commission of Shenzhen[JCYJ20210324102013036] |
| WOS Research Area | Biophysics ; Chemistry ; Materials Science |
| WOS Subject | Biophysics ; Chemistry, Physical ; Materials Science, Biomaterials |
| WOS ID | WOS:000740205400001 |
| Publisher | ELSEVIER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/173857 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Yang, Ke; Zhao, Ying |
| Affiliation | 1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518000, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China |
| Recommended Citation GB/T 7714 | Khan, M. Saleem,Yang, Chunguang,Pan, Haobo,et al. The effect of high temperature aging on the corrosion resistance, mechanical property and antibacterial activity of Cu-2205 DSS[J]. COLLOIDS AND SURFACES B-BIOINTERFACES,2022,211:9. |
| APA | Khan, M. Saleem,Yang, Chunguang,Pan, Haobo,Yang, Ke,&Zhao, Ying.(2022).The effect of high temperature aging on the corrosion resistance, mechanical property and antibacterial activity of Cu-2205 DSS.COLLOIDS AND SURFACES B-BIOINTERFACES,211,9. |
| MLA | Khan, M. Saleem,et al."The effect of high temperature aging on the corrosion resistance, mechanical property and antibacterial activity of Cu-2205 DSS".COLLOIDS AND SURFACES B-BIOINTERFACES 211(2022):9. |
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment